Showing results 1 to 3 of 3
A study on lateral thermosonic bonding technology = 횡방향 열초음파 본딩 기술에 관한 연구link Ha, Chang-Wan; 하창완; et al, 한국과학기술원, 2010 |
Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02 |
전자 패키징용 경사진 전도성 범프에 관한 연구 = A study on inclined conductive bump for electronic packaginglink 박아영; Park, Ah-Young; et al, 한국과학기술원, 2011 |
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