Browse "School of Mechanical and Aerospace Engineering(기계항공공학부)" by Type Article
Showing results 2141 to 2160 of 15924
| Bed-mounted laparoscopic surgical robot system with novel positioning arm mechanism Chung, Deok Gyoon; Hwang, Minho; Cheon, Byungsik; Kong, Dukyoo; Kang, DongHoon; Lee, Dong-Ho; Kim, Chang-Kyun; et al, INTERNATIONAL JOURNAL OF MEDICAL ROBOTICS AND COMPUTER ASSISTED SURGERY, v.18, no.4, 2022-08 |
| Behavior of a water drop impinging on heated porous surfaces Kim, Woo Shik; Lee, Sang Yong, EXPERIMENTAL THERMAL AND FLUID SCIENCE, v.55, pp.62 - 70, 2014-05 |
| BEHAVIOR OF A WATER DROP IMPINGING ON POROUS SUBSTRATES-EXAMINATION OF CONTACT-LINE DRAG EFFECT Kim, Woo Shik; Lee, Sang Yong, ATOMIZATION AND SPRAYS, v.26, no.3, pp.257 - 274, 2016 |
| Behavior of composite structures orientations towards their failure and damage Baluch, Abrar-Ul-Haq Khan; Kim, Chun-Gon, JOURNAL OF COMPOSITE MATERIALS, v.49, no.29, pp.3703 - 3711, 2015-12 |
| Behavior of Double Emulsions in a Cross-Type Optical Separation System Lee, Kyung-Heon; Kim, Sang-Bok; Yoon, Sang-Youl; Lee, Kang-Soo; Jung, Jin-Ho; Sung, Hyung-Jin, LANGMUIR, v.28, no.19, pp.7343 - 7349, 2012-05 |
| Behavior of dragon skin flexible metal bumper under hypervelocity impact Kim, Yunho; Choi, Chunghyeon; Sathish Kumar, Sarath Kumar; Kim, Chun-Gon, INTERNATIONAL JOURNAL OF IMPACT ENGINEERING, v.125, pp.13 - 26, 2019-03 |
| Behavior of hydrogen hollow-cone spray depending on the ambient pressure Lee, Sanguk; Kim, Gyeonggon; Bae, Choongsik, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.46, no.5, pp.4538 - 4554, 2021-01 |
| Behavior of plasticity-induced crack closure and roughness-induced crack closure in aluminum alloy Kim, JH; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.23, no.1, pp.247 - 251, 2001 |
| Behavior of Shear Thickening Fluid (STF) impregnated fabric composite rear wall under hypervelocity impact Kim, Yunho; Park, Yurim; Cha, JiHun; Ankem, Venkat Akhil; Kim, Chun-Gon, COMPOSITE STRUCTURES, v.204, pp.52 - 62, 2018-11 |
| Behavior of the secondary vortex during a vortex-wedge interaction Park, JH; Lee, Duck-Joo, AIAA JOURNAL, v.37, no.9, pp.1131 - 1133, 1999-09 |
| Behaviour of fatigue Crack Growth and Closure through a Tensile Residual Stress Field under Compressive Applied Loading k.j.kang; Song, Ji Ho; y.y.earmme, FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES, v.12, no.5, pp.363 - 376, 1990-01 |
| Benchmark 3 - Springback of an Al-Mg alloy in warm forming conditions Manach, Pierre-Yves; Coer, Jeremy; Laurent, Jegata Herve; Yoon, Jeong Whan, JOURNAL OF PHYSICS: CONFERENCE SERIES, v.734, no.2, 2016-09 |
| Bendable and flexible supercapacitor based on polypyrrole-coated bacterial cellulose core-shell composite network Wang, Fan; Kim, Hyun Jun; Park, Sukho; Kee, Chang-Doo; Kim, Seong-Jun; Oh, Il-Kwon, COMPOSITES SCIENCE AND TECHNOLOGY, v.128, no.-, pp.33 - 40, 2016-05 |
| Bendable metallic sandwich plates with a sheared dimple core SEONG, DAEYONG; Jung, Chang Gyun; Yang, Dong-Yol; Kim, JH; Chung, WJ; Lee, MY, SCRIPTA MATERIALIA, v.63, no.1, pp.81 - 84, 2010-07 |
| Bendable polymer electrolyte fuel cell using highly flexible Ag nanowire percolation network current collectors Chang, Ikwhang; Park, Taehyun; Lee, Jinhwan; Lee, Min Hwan; Ko, Seung Hwan; Cha, Suk Won, JOURNAL OF MATERIALS CHEMISTRY A, v.1, no.30, pp.8541 - 8546, 2013 |
| BENDING BEHAVIOR OF SIMPLY SUPPOTED METALLIC SANDWICH PLATES WITH DIMPLED CORES Seong, Dae-Yong; Jung, Chang Gyun; Yang, Dong-Yol; Ahn, DG, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.22, pp.6179 - 6184, 2008 |
| Bending behavior to fracture of an aluminium alloy involving pre-strain Pradeau, A.; Thuillier, S.; Yoon, Jeong Whan, KEY ENGINEERING MATERIALS, v.725 KEM, pp.495 - 501, 2017-01 |
| Bending behaviors of metallic sandwich plates with a sheared dimple core under simply supported loading Seong, D. Y.; Jung, C. G.; Yang, Dong-Yol; Nam, G. H.; Ahn, D. G., JOURNAL OF SANDWICH STRUCTURES MATERIALS, v.13, no.4, pp.445 - 466, 2011-07 |
| Bending of Tapered Anisotropic Sandwich Plates with Arbitrary Edge Conditions Jeon, J. S.; Hong, Chang Sun, AIAA JOURNAL, v.30, no.7, pp.1762 - 1769, 1992-07 |
| Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02 |
Discover
Open Access
Date issued
- 5,764 2020 - 2024
- 16,597 2010 - 2019
- 14,059 2000 - 2009
- 7,691 1990 - 1999
- 2,266 1980 - 1989