Browse "School of Mechanical and Aerospace Engineering(기계항공공학부)" by Type Article
Showing results 10801 to 10820 of 15792
| Stratified liquefied petroleum gas-dimethyl ether compression ignition engine combustion at various intake valve open timings Yeom, K.; Bae, Choongsik, INTERNATIONAL JOURNAL OF ENGINE RESEARCH, v.11, no.3, pp.187 - 197, 2010 |
| STRATIFYING PROCESS OF A FLUID IN AN ENCLOSURE WITH A TIME-VARYING VERTICAL THROUGH-FLOW Hyun, Jae Min; IN, KM, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.32, no.11, pp.2081 - 2086, 1989-11 |
| Streak instability in turbulent channel flow: the seeding mechanism of large-scale motions de Giovanetti, Matteo; Sung, Hyung Jin; Hwang, Yongyun, JOURNAL OF FLUID MECHANICS, v.832, pp.483 - 513, 2017-10 |
| Streamwise streaks and secondary instability in a two-dimensional bent channel Park, Donghun; Park, Seung O., THEORETICAL AND COMPUTATIONAL FLUID DYNAMICS, v.28, no.3, pp.267 - 293, 2014-06 |
| Strength analysis of adhesively-bonded tubular single lap steel-steel joints under axial loads considering residual thermal stresses Kim, YG; Lee, SJ; Lee, Dai Gil; Jeong, KS, JOURNAL OF ADHESION, v.60, no.1-4, pp.125 - 140, 1997 |
| Strength design and minimization of residual stresses in reversible GaAs wafer bonding process Choi, ST; Song, JY; Kim, JH; Lee, S; Earmme, Youn-Young, KEY ENGINEERING MATERIALS, v.306-308, pp.1337 - 1342, 2006-03 |
| Strength modeling of sheet metals from shear to plane strain tension Lou, Yanshan; Zhang, Saijun; Yoon, Jeong Whan, INTERNATIONAL JOURNAL OF PLASTICITY, v.134, 2020-11 |
| Strength of Adhesively-Bonded Tubular Single Lap Carbon/Epoxy Composite-Steel Joints Young Goo Kim; Je Hoon Oh; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.33, no.20, pp.1897 - 1917, 1999-10 |
| Strength of Double Lap Joints Bonded With Carbon Black Reinforced Adhesive Under Cryogenic Environment Park, Sang Wook; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.23, no.4, pp.619 - 638, 2009 |
| Strength of functionally gradient composite hemispherical bearings Lee, SM; Park, DC; Kim, BC; Lee, Dai Gil, COMPOSITE STRUCTURES, v.74, no.2, pp.145 - 152, 2006-07 |
| Strength of modes in rotating machinery Lee, Chong-Won; Han, Dong-Ju, JOURNAL OF SOUND AND VIBRATION, v.313, no.1-2, pp.268 - 289, 2008-06 |
| Stress -related topology optimization of shell structures using IGA/TSA-based Moving Morphable Void (MMV) approach Zhang, Weisheng; Jiang, Shan; Liu, Chang; Li, Dingding; Kang, Pilseong; Youn, Sung-Kie; Guo, Xu, COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, v.366, 2020-07 |
| Stress Analysis and Design for a Structural Fatigue Testing Machine 이순복, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.5, no.2, pp.115 - 124, 1991-11 |
| Stress based prediction of formability and failure in incremental sheet forming Haque, Md Ziaul; Yoon, Jeong Whan, INTERNATIONAL JOURNAL OF MATERIAL FORMING, v.9, no.3, pp.413 - 421, 2016-07 |
| Stress Evaluation in Plane Strain Problem by Elasto-plastic Finite Element Analysis with Reduced Integration Huh, Hoon; Kim, Se Ho, 대한기계학회 춘계학술대회 논문집, 1995 |
| Stress evaluation with numerical integration schemes in finite element analysis of elasto-plastic bending Huh, Hoon; Kim, SH, COMMUNICATIONS IN NUMERICAL METHODS IN ENGINEERING, v.16, no.11, pp.755 - 767, 2000-11 |
| Stress Field Near Teransverse Cracks under Extension or In-Plane Shear in Composite Laminates 임세영, JOURNAL OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS, v.3, no.2, pp.121 - 129, 1989-08 |
| Stress integration method for a nonlinear kinematic/isotropic hardening model and its characterization based on polycrystal plasticity Cardoso, Rui P. R.; Yoon, Jeong Whan, INTERNATIONAL JOURNAL OF PLASTICITY, v.25, no.9, pp.1684 - 1710, 2009-09 |
| Stress integration-based on finite difference method and its application for anisotropic plasticity and distortional hardening under associated and non-associated flow rules Choi, Hyunsung; Yoon, Jeong Whan, COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, v.345, pp.123 - 160, 2019-03 |
| Stress intensities at the triple junction of a multilevel thin film package Jeon, Insu; Kang, Ki-Ju; Im, Seyoung, MICROELECTRONICS RELIABILITY, v.48, no.5, pp.749 - 756, 2008-05 |
Discover
Open Access
Date issued
- 5,472 2020 - 2024
- 16,593 2010 - 2019
- 14,059 2000 - 2009
- 7,691 1990 - 1999
- 2,266 1980 - 1989