Browse "School of Electrical Engineering(전기및전자공학부)" by Subject vertical-cavity
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| A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10 |
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