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Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages Kumar, Gokul; Sitaraman, Srikrishna; Cho, Jonghyun; Sundaram, Venky; Kim, Joungho; Tummala, Rao R, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.1, pp.87 - 99, 2016-01 |
Power distribution networks for system-on-package: Status and challenges Swaminathan, M.; Kim, Joungho; Novak, I.; Libous, J.P., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.2, pp.286 - 300, 2004-05 |
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