Browse "School of Electrical Engineering(전기및전자공학부)" by Subject measurement
Showing results 1 to 15 of 15
| A condition on spatial resolution of IR collimators for testing of thermal imaging systems Chrzanowski, K; Lee, Hee Chul; Wrona, W, OPTICAL ENGINEERING, v.39, no.5, pp.1413 - 1417, 2000-05 |
| An empirical study of malicious domain name system queries in the enterprise network = 엔터프라이즈 네트워크 내 악성 DNS 쿼리 데이터에 대한 실증적 연구link kim, so-ra; 김소라; et al, 한국과학기술원, 2015 |
| Channel Adapted Antenna Augmentation for Improved Wi-Fi Throughput Zhang, Yanbo; Sun, Weiping; Ren, Yidong; Lee, Sung-Ju; Li, Mo, IEEE TRANSACTIONS ON MOBILE COMPUTING, v.22, no.11, pp.6297 - 6310, 2023-11 |
| Distribution of Eigenvalues for 2x2 MIMO Channel Capacity Based on Indoor Measurements Kim, Won-Sop; Lee, Hyuck-Jae; Kim, Myung-Don; Chung, Hyun-Kyu, IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, v.11, no.4, pp.1255 - 1259, 2012-04 |
| Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 |
| Intelligent Channel Bonding in 802.11n WLANs Deek, Lara; Garcia-Villegas, Eduard; Belding, Elizabeth; Lee, Sung-Ju; Almeroth, Kevin, IEEE TRANSACTIONS ON MOBILE COMPUTING, v.13, no.6, pp.1242 - 1255, 2014-06 |
| Measurement and Analysis of a High-Speed TSV Channel Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Myung-Hoi; Kim, Ki-Yeong; Lee, Jun-Ho; Lee, Hyung-Dong; Park, Kun-Woo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.10, pp.1672 - 1685, 2012-10 |
| Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
| Measurement-based admission control at edge routers Nam, Seung Yeob; Kim, Sunggon; Sung, Dan Keun, IEEE-ACM TRANSACTIONS ON NETWORKING, v.16, no.2, pp.410 - 423, 2008-04 |
| Measuring the machine intelligence quotient (MIQ) of human-machine cooperative systems Park, HJ; Kim, Byung Kook; Lim, KY, IEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICS PART A-SYSTEMS AND HUMANS, v.31, no.2, pp.89 - 96, 2001-03 |
| Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
| Perceived illumination measured Petrov, AP; Kim, CY; Kweon, In-So; Seo, YS, COLOR RESEARCH AND APPLICATION, v.23, no.3, pp.159 - 168, 1998-06 |
| Performance Analysis of Spatially Correlated MIMO-OFDM Beamforming Systems with the Maximum Eigenvalue Model from Measured MIMO Channels Kim, Won-Sop; Lee, Kyung-Nam; Kim, Myung-Don; Park, Jae-Joon; Chung, Hyun-Kyu; Lee, Hyuck-Jae, IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, v.11, no.10, pp.3744 - 3753, 2012-10 |
| Probing-based estimation of end-to-end available bandwidth Nam, SY; Kim, S; Kim, J; Sung, Dan Keun, IEEE COMMUNICATIONS LETTERS, v.8, no.6, pp.400 - 402, 2004-06 |
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