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High-frequency TSV Failure Detection Method with Z parameter Kim, Joohee; Jung, Daniel H; Chok, Jonghyun; Pak, Jun So; Yook, Jong Min; Kim, Jun Chul; Kim, Joungho, IEEE 38th International symposium of Test and Failure Analysis (ISTFA), IEEE, 2012-11 |
Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs Kim, Kiyeong; Yook, Jong Min; Kim, Junchul; Kim, Heegon; Lee, Junho; Park, Kunwoo; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.11, pp.1891 - 1906, 2013-11 |
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