Browse "School of Electrical Engineering(전기및전자공학부)" by Author Tummala, Rao R.
Showing results 1 to 5 of 5
| Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 |
| Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 |
| Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites Watanabe, Atom O; Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Min, Junki; Wong, Denny; Pulugurtha, Markondeya R.; et al, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, pp.206 - 210, Institute of Electrical and Electronics Engineers Inc., 2016-05 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
| Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules Sitaraman, Srikrishna; Sukumaran, Vijay; Pulugurtha, Markondeya Raj; Wu, Zihan; Suzuki, Yuya; Kim, Youngwoo; Sundaram, Venky; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1410 - 1418, 2017-09 |
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