Showing results 1 to 4 of 4
An efficient crosstalk parameter extraction method for high-speed interconnection lines Sung, M.; Ryu, W.; Kim, H.; Kim, J.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.148 - 155, 2000-05 |
Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 |
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
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