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Ground Guard Structure to Reduce the Crosstalk Noise and Electromagnetic Interference (EMI) in a Vertical Probe Card for Wafer-level Testing Kim, Joung-Ho; Lee, Eunjung; Lee, Manho; Kim, Jonghoon J.; Kim, Mijoo; Kim, Jonghoon; Park, Jeoungkun; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014-08-03 |
Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27 |
Probe Card Design with Signal and Power Integrity for Wafer-level Application Processor Test in LPDDR Channel Kim, Joungho; Song, Jinwook; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
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