Browse "School of Electrical Engineering(전기및전자공학부)" by Author Kam, Dong Gun
Showing results 1 to 10 of 10
| A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002 |
| A Novel Twisted Differential Line on PCB: Crosstalk Model and Its Application to High-speed Interconnect Circuit Design Kim, Joungho; Kam, Dong Gun, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.153 - 156, IEEE, 2002 |
| Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization Song, Eakhwan; Cho, Jeonghyeon; Kim, Joungho; Kam, Dong Gun, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 4, IEEE, 2007-07-09 |
| Circuital Approach to Evaluate Shielding Effectiveness of Rectangular Enclosures with Apertures on Multiple Sides Kim, Joungho; Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong-Hwa, International Symposium on Electromagnetic Compatibility (EMC Europe), pp.295 - 300, 2004 |
| Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong Hwa; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.566 - 577, 2010-08 |
| Data-dependent Jitter using Single Pulse Analysis Method in High-speed Interconnection Kim, Joungho; Song, Eakhwan; Lee, Junho; Kim, Jingook; Kam, Dong Gun; Ryu, Chunghyun, 7th EPTC 2005, pp.810 - 813, 2005 |
| Multiport measurement method using a two-port network analyzer with remaining ports unterminated Kam, Dong Gun; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, no.9, pp.694 - 696, 2007-09 |
| Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications Choi, Jinwoo; Kam, Dong Gun; Chung, Daehyun; Srinivasan, Krishna; Govind, Vinu; Kim, Joungho; Swaminathan, Madhavan, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.2, pp.180 - 190, 2007-05 |
| Special Section on Through Silicon Vias Foreword Kam, Dong Gun; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.152 - 153, 2011-02 |
| Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity Kim, Joungho; Lee, Heeseok; Park, Bongcheol; Kam, Dong Gun, IEEE 6th Workshop on Signal Propagation on Interconnects, pp.41 - 43, IEEE, 2002 |
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