Showing results 1 to 5 of 5
A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias Park, Junyong; Jung, Daniel H.; Kim, Byunggon; Choi, Sumin; Kim,Youngwoo; Park,Shinyoung; Park,Gapyeol; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.4, pp.1198 - 1206, 2019-08 |
Bump-less High Speed Channel on Silicon, Organic and Glass Interposer Kim, Joung-Ho; Lee, Hyunsuk; Kim, Heegon; Kim, Kiyeong; Jung, Daniel H.; Kim, Jonghoon J.; Choi, Sumin; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI), 2014-08-05 |
Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC Kim, Joung-Ho; Song, Eunseok; Jung, Daniel H.; Kim, Youngwoo, 2014 International Symposium on Electromagnetic Compatability, Tokyo(EMC2014), 2014 International Symposium on Electromagnetic Compatability, Tokyo(EMC2014), 2014-05-15 |
Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects Choi, Sumin; Park, Junyong; Jung, Daniel H.; Kim, Joungho; Kim, Heegon; Kim, Kiyeong, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2139 - 2144, Electronic Components and Technology Conference 2017, 2017-05-30 |
Three-Phase Magnetic Field Design for Low EMI and EMF Automated Resonant Wireless Power Transfer Charger for UAV Kim, Joungho; Kim, Hongseok; Jung, Daniel H.; Yoon, Kibum; Cho,Yeonje; Kong, Sunkyu; Kwack, Younghwan, IEEE Wireless Power Transfer Conference 2015, IEEE Wireless Power Transfer Conference 2015, 2015-05-13 |
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