Browse "School of Electrical Engineering(전기및전자공학부)" by Author Daniel H. Jung
Showing results 1 to 6 of 6
| Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling Kim, Joungho; Heegon Kim; Sukjin Kim; Changhyun Ch; Daniel H. Jung; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Crosstalk-Included Eye-Diagram Estimation for High-speed Silicon, Organic, and Glass Interposer Channels on 2.5D/3D IC Kim, Joungho; Heegon Kim; Daniel H. Jung; Jonghoon J. Kim; Jaemin Lim; Hyunsuk Lee; Kyungjun Cho; et al, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics Kim, Joungho; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 |
| Measurement-based Signal Quality Test of High-speed TSV Channel Kim, Joungho; Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J; Jun So Pak, 2012 International Microelectronics and Packaging Society, IEEE, 2010-09-14 |
| Optimized Inverter Design of Ring Oscillator based Wafer-Level TSV Connectivity Test (RO-TSV-CT) Kim, Joungho; Joohee Kim; Daniel H. Jung; Junho Lee; Kunwoo Park, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Structure of Handheld Resonant Magnetic Coupling Charger (HH-RMCC) for Electric Vehicle considering Electromagnetic Field Kim, Joungho; Chiuk Song; Hongseok Kim; Sunkyu Kong; Daniel H. Jung; In-Myoung Kim; Young-il Kim; et al, IEEE Wireless Power Transfer Conference 2013 Technologies, Systems and Applications, IEEE, 2012-05-16 |
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