Browse "School of Electrical Engineering(전기및전자공학부)" by Subject silicon through-via (STV)
Showing results 1 to 1 of 1
| Suppression of power/ground inductive impedance and simultaneous switching noise using silicon through-via in a 3-D stacked chip package Ryu, C; Park, J; Pak, JS; Lee, K; Oh, T; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, pp.855 - 857, 2007-12 |
Discover
Open Access
- 573 OA Article
Date issued
- 4,915 2020 - 2024
- 18,938 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989