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Browse "School of Electrical Engineering(전기및전자공학부)" by Subject segmentation method

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Showing results 1 to 12 of 12

1	Analytical calculation of radiated emissions from rectangular power bus using embedded capacitor in high-speed packages and PCBs Jeong, Y; Kim, Joungho; Kwon, JH, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, pp.358 - 361, 2006-02
2	Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method Kim, Jae-Min; Lee, Woo-Jin; Shim, Yu-Jeong; Shim, Jong-Joo; Kim, Ki-Yeong; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.647 - 659, 2010-08
3	Fast and analytical eye diagram estimation method for high bandwidth memory (HBM) channel including Tx power noise and channel crosstalk = 고 대역폭 메모리 채널에서 송신단 전력 노이즈와 채널 간섭 현상을 고려한 빠르고 분석적인 아이다이어그램 예측 기법 link Kim, Ki Yeong; 김기영; et al, 한국과학기술원, 2015
4	Hybrid analytical Modeling method for split power bus in multilayered package Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02
5	Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor Kim, Joungho; Jeong, Y, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.534 - 536, 2006-10
6	Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs Kim, Kiyeong; Yook, Jong Min; Kim, Junchul; Kim, Heegon; Lee, Junho; Park, Kunwoo; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.11, pp.1891 - 1906, 2013-11
7	Matrix substitution method for power bus analysis with isolated power island in high-speed packages and PCBs Jeong, Y; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.31 - 33, 2006-01
8	Modeling and analysis of 3D-power distribution network (3D-PDN) in TSV-based 3D-IC based on a segmentation method = 구조 분할 방법에 기반한 관통 실리콘 비아 기반 3차원 IC 내 3차원 전력 분배망의 모델링 및 분석 link Kim, Ki-Yeong; 김기영; et al, 한국과학기술원, 2011
9	Modeling and analysis of 3D-power distribution network (3D-PDN) in TSV-based 3D-IC based on a segmentation method = 구조 분할 방법에 기반한 관통 실리콘 비아 기반 3차원 IC 내 3차원 전력 분배망의 모델링 및 분석 link Kim, Ki-Yeong; 김기영; et al, 한국과학기술원, 2011
10	Modeling and analysis of power distribution network in 2.5D and 3D IC based on segmentation method and target impedance considering current spectrum = 구조분할 방법과 전류 스펙트럼에 기반한 목표 임피던스를 이용한 2.5차원/3차원 반도체에서 전력분배망의 모델링 및 분석 link Kim, Youngwoo; 김영우; et al, 한국과학기술원, 2015
11	Segmentation method based modeling and analysis of a glass package power distribution network (PDN) Kim, Youngwoo; Fujimoto, Daisuke; Kaji, Shugo; Wada, Shinpei; Park, Hyunwook; Lho, Daehwan; Kim, Joungho; et al, IEICE NONLINEAR THEORY AND ITS APPLICATIONS, v.11, no.2, pp.170 - 188, 2020-04
12	Segmentation method for modeling and simulation of electromagnetic bandgap (EBG) structures in three-dimensional integrated circuit (3D-IC) and package = 구조분할방법을 이용한 3차원 반도체 및 패키지 내의 EBG 구조 모델링 및 시뮬레이션 방법 제안 link Kim, Myung-Hoi; 김명회; et al, 한국과학기술원, 2012

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