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Browse "School of Electrical Engineering(전기및전자공학부)" by Subject printed circuit board (PCB)

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Showing results 1 to 6 of 6

1	A low-cost high-efficiency CCFL inverter with new capacitive sensing and control Kim, SK; Han, HS; Woo, YJ; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, pp.1444 - 1451, 2006-09
2	High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07
3	Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects Cho, Jeonghyeon; Song, Eak-Hwan; Kim, Hee-Gon; Ahn, Seung-Young; Pak, Jun-So; Kim, Ji-Seong; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822, 2011-08
4	Modeling and measurement of simultaneous switching noise coupling through signal via transition Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08
5	Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05
6	Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04

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