Browse "School of Electrical Engineering(전기및전자공학부)" by Subject adhesive
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| Calcium-Modified Silk Patch as a Next-Generation Ultrasound Coupling Medium Lee, Sang-Mok; Lee, Taemin; Kim, Hyojung; Jo, Yehhyun; Kim, Myeong Gee; Kim, Subeen; Bae, Hyeon-Min; et al, ACS APPLIED MATERIALS & INTERFACES, v.13, no.47, pp.55827 - 55839, 2021-12 |
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