Showing results 1 to 5 of 5
3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology Yoon, Jun-Bo; Kim, BI; Choi, YS; Yoon, E, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.279 - 288, 2003-01 |
A 3.1 to 5 GHz CMOS transceiver for DS-UWB systems Park, Bonghyuk; Lee, Kyung Ai; Hong, Songcheol; Choi, Sangsung, ETRI JOURNAL, v.29, no.4, pp.421 - 429, 2007-08 |
A Fully Integrated Triple-Band CMOS Class-E Power Amplifier With a Power Cell Resizing Technique and a Multi-Tap Transformer Kim, Wooyoung; Son, Hyuk Su; Kim, Joon Hyung; Jang, Joo Young; Oh, Inn Yeal; Park, Chul Soon, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.23, no.12, pp.659 - 661, 2013-12 |
A varactor-tuned MMIC VCO using InP-based RTD/HBT technology Choi, S; Lee, B; Kim, T; Yang, Kyounghoon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.45, no.5, pp.408 - 411, 2005-06 |
Low DC-power Ku-band differential VCO based on an RTD/HBT MMIC technology Choi, Sun-Kyu; Jeong, Yong-Sik; Yang, Kyoung-Hoon, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.15, no.11, pp.742 - 744, 2005-11 |
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