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Design of the PCB embedded active IC structure for ultra-thin wearable application with low-RFI Bae, Bumhee; Shim, JongWan; Kim, Younho; Kim, HyungGeun; Park, HarkByeong; Kim, Joungho, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017, pp.325 - 327, Institute of Electrical and Electronics Engineers Inc., 2017-06 |
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