Browse "School of Electrical Engineering(전기및전자공학부)" by Author Park, HyoHoon
Showing results 1 to 60 of 166
| 0.18um CMOS Multi-Channel 5Gbit/s VCSEL Driver with Low Crosstalk Lee, T.W.; Kang, S.K.; Park, HyoHoon, OECC, v.0, no.0, pp.656 - 657, OECC, 2005-07-01 |
| 10 Gb/s SerDes for bidirectional chip-to-memory optical interconnection Nga, N.T.H.; Lee, M.H.; Lee, T.W.; Park, HyoHoon, 2007 Conference on Lasers and Electro-Optics - Pacific Rim, CLEO/PACIFIC RIM, v.0, no.0, pp.0 - 0, CLEO, 2007-08-26 |
| 10 Gb/s VCSEL transmitter for chip-to-chip optical interconnection Vu, N.A.; Lee, T.W.; Park, HyoHoon, Asia Pacific Optical Conference (APOC) 2006, v.0, no.0, pp.0 - 0, APOC, 2006-09-05 |
| 10 Gbps/ch Full-Duplex Optical Link Using a Single-Fiber Channel for Signal Transmission Nga, Nguyen T. H.; Sangirov, Jamshid; Joo, Gwan-Chong; Yoo, Byueng-Su; Ukaegbu, Ikechi Augustine; Lee, Tae-Woo; Cho, Mu-Hee; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.26, no.6, pp.609 - 612, 2014-03 |
| 10Gb/s CMOS optical receiver for VSR-optical interconnection Park, HyoHoon, 제11회 반도체학술대회 , v.0, no.0, pp.0 - 0, 반도체학술대회, 2004-02-01 |
| 1545NM-pumped long-wavelengh-band erbium-doped fiber amplifier with enhanced power conversion efficiency Choi, BH; Chu, MJ; Park, HyoHoon, Europe Conference on Optical and Wireless Communications (ECOC) 2002, Proceedings, pp.1 - 2, IEEE, 2002-07-01 |
| 155 Mb/s CMOS post amplifier for optical-line-terminal receiver in ATM-PON system Kang S.; Hwang, S.H.; Park, K.-S.; Park, HyoHoon, APOC 2002:Optical Components and Transmission Systems, v.4906, no.46, pp.224 - 230, SPIE, 2002-10-16 |
| 2.5 Gb/s CMOS VCSEL driver circuit with various modulation depths Kwak, HY; Kang, S; Hwang, SH; Park, HyoHoon, APOC, v.4905, no.0, pp.533 - 538, SPIE, 2002-10-01 |
| 2.5 Gbit/s multifunctional CMOS transceiver for chip-to-chip optical link Kang, SK; Lee, TW; Park, HyoHoon, ELECTRONICS LETTERS, v.42, no.7, pp.410 - 412, 2006-03 |
| 320km optical transmission using EDFA and Raman amplifier for 10Gbit/s 128 channel DWDM signals Choi, BH; Kim, SK; Chang, SH; Chu, MJ; Park, HyoHoon, The 3rd International Conference on Advanced Communication Technology (ICACT) 2001, v.0, no.0, pp.734 - 737, IEEE, 2001-02-01 |
40 Gb/s optical subassembly module for a multi-channel bidirectional optical link Sangirov, Jamshid; Joo, Gwan-Chong; Choi, Jae-Shik; Kim, Do-Hoon; Yoo, Byueng-Su; Ukaegbu, Ikechi Augustine; Nga, Nguyen T. H.; et al, OPTICS EXPRESS, v.22, no.2, pp.1768 - 1783, 2014-01 |
| 5-Gb/s chip-to-chip optical interconnection using polymeric waveguides Kim, D.W.; Cho, I.K.; Ahn, S.H.; Park, HyoHoon, 2007 Conference on Lasers and Electro-Optics - Pacific Rim, CLEO/PACIFIC RIMnce on Lasers and Electro-Optics - Pacific Rim, CLEO/PACIFIC RIM, v.0, no.0, pp.1078 - 1079, CLEO, 2007-08-26 |
| A 0.18um Si-CMOS limiting amplifier for 10-Gb/s optical iInterconnection Kang, SK; Lee, TW; Park, HyoHoon, OECC, v.0, no.0, pp.654 - 655, OECC, 2005-07-04 |
| A 2.5Gb/s CMOS transimpedance amplifier using a novel active inductor load Oh, YH; Lee, SG; Park, HyoHoon, 27th ESSCIRC (European Solid-State Circuits Conference), v.0, no.0, pp.178 - 181, 2001-09-18 |
| A comparative analysis of short- and long-wavelength multi-chip optical transmitter modules for optical pcb applications Shirazy, SM; Ukaegbu, AI; Kim, DW; Lee, TW; Cho, MH; Kim, SJ; Yoo, BS; et al, Photonics Packaging, Integration, and Interconnects IX, v.7221, pp.0 - 0, SPIE, 2009-01-26 |
| A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10 |
| A large area and 2 dimensional optical interconnection platform Hwang, S.H.; Cho, M.H.; Kang, S.K.; Lee, T.W.; Park, HyoHoon; Rho, B.S., 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1916 - 1920, 2007-05-29 |
| A low-power-consumption VCSEL driver IC for 10Gbps direct modulation using InGaP/GaAs HBT Eo, JY; Kang, S; Park, HyoHoon; Jung, D. Y.; Park, Chul Soon; Yoon, K. S., The Fifth Pacific Rim Conference on Laser and Electro-Optics, v.0, no.0, pp.434 - 434, 2003-12-15 |
| A novel automatic power control method for multichannel VCSEL driver Kang, S.K.; Lee, T.W.; Park, HyoHoon; Plant D.V., Pacific Rim Conference on Lasers and Electro-Optics, CLEO/Pacific Rim 2005, v.2005, pp.836 - 838, 2005-07-11 |
| A novel bidirectional CMOS transceiver for chip-to-chip optical interconnects Kang, SK; Lee, TW; Plant, DV; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.1-4, pp.70 - 72, 2006-01 |
| A perfectly current matched charge pump of CP-PLL for chip-to-chip optical link Hieu, N.T.; Lee, T.W.; Park, HyoHoon, 2007 Conference on Lasers and Electro-Optics - Pacific Rim, CLEO/PACIFIC RIM, pp.1473 - 1474, 2007-08-26 |
| A simple method for calculating coupling efficiency in optical interconnection system involving various misalignment parameters Cho, HS; Kim, WH; Park, HyoHoon, OPTICS AND LASERS IN ENGINEERING, v.42, no.5, pp.503 - 509, 2004-11 |
| Align-free assembling of connectors and modules on an optical PCB for chip-to-chip optical interconnection Hwang, SH; Cho, MH; Park, HyoHoon, OECC, v.0, no.0, pp.0 - 0, OECC, 2005-07-04 |
| All-digital phase-locked loop for optical interconnect applications Hieu, N.T.; Lee, T.W.; Park, HyoHoon, 9th International Conference on Advanced Communication Technology, ICACT 2007, v.3, pp.1829 - 1832, ICACT, 2007-02-12 |
| Amorphous GaAs passivation of ion-beam-etched InGaAs vertical-cavity surface-emitting lasers Park, HyoHoon; Yoo, BS; Chu, HY; Park, MS; Lee, JJ; Lee, HG; Lee, EH; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.29, no.4, pp.522 - 525, 1996-08 |
| An active optical backplane system using optical slots In-Kui Cho,; Yoon, KB; Ahn, SH; Sung, HK; Ha, S; Lee, DJ; Rho, BS; et al, ECOC, v.0, no.0, pp.0 - 0, ECOC, 2004-09-05 |
| An InGaP/GaAs optical driver IC for 10Gb/s direct modulation VCSEL diodes Eo, JY; Kang,S; Park, HyoHoon, Asia-Pacific Microwave Conference 2003, v.0, no.0, pp.1126 - 1129, APMC2003, 2003-11-04 |
| Analysis of thermal effects on crosstalk and performance of optoelectronic transmitter modules Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, OptoElectronics and Communications Conference, Optical Society of Korea, 2012-07-05 |
| Architecture of connecting optical PCB, transceiver modules for optical PCB and optical connection block Park, HyoHoon; Hwang, Sung Hwan; Cho, Han Seo; Cho, Mu Hee, 2006-06-13 |
| Bias-Induced polarization properties in vertical-cavity surface-emitting lasers Yoo, B. S.; Chu, H. Y.; Park, HyoHoon; Lee, E.H., SPIE Photonics West 1998, pp.0 - 0, SPIE, 1998-01-28 |
| Bidirectional optical transceiver integrated with an envelope detector for automatically controlling the direction of transmission Ngo, TH; Nguyen, NTH; Sangirov, J; Im, DM; Cho, MH; Lee, TW; Park, HyoHoon, 59th Electronic Components and Technology Conference, ECTC 2009, pp.2098 - 2100, ECTC 2009, 2009-05-26 |
| Bidirectional optical transceiver with automatically directional controlling function Ngo, TH; Nguyen, NTH; Lee, Tae Woo; Park, HyoHoon, 11th International Conference on Advanced Communication Technology, ICACT 2009, v.3, pp.1882 - 1884, ICACT 2009, 2009-02-15 |
| Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections Nguyen, Nga T. H.; Ukaegbu, Ikechi A.; Sangirov, Jamshid; Cho, Mu-Hee; Lee, Tae-Woo; Park, HyoHoon, OPTICAL ENGINEERING, v.52, no.12, 2013-12 |
| Board-to-board optical interconnection system using optical slots Cho, IK; Yoon, KB; Ahn, SH; Jeong, MY; Sung, HK; Lee, BH; Heo, YU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.7, pp.1754 - 1756, 2004-07 |
| Board-to-board optical interconnection using a 4f hybrid imaging system Park, YJ; Hwang, SH; Park, HyoHoon, International Topical Meeting on Photonic Switching , pp.0 - 0, 2002-07-01 |
| Board-to-board optical interconnection using novel optical plug and slot Cho, IK; Yoon, KB; Ahn, SH; Kim, JT; Lee, WJ; Shin, KU; Heo, YU; et al, SPIE Annual Meeting 2004, v.5524, pp.359 - 367, SPIE, 2004-08-01 |
| Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08 |
| Characteristics of long-wavelength-band EDFA pumped by 1.53 μm band Choi, B.H.; Park, HyoHoon; Chu, M.; Kim, S.K., 2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000), pp.129 - 0, SPIE, 2000-09-10 |
| Chip-to-chip optical link by using optical wiring method Cho, I.K.; Ahn, S.H.; Jeong, M.Y.; Rho, B.S.; Park, HyoHoon, Photonics: Design, Technology, and Packaging III, v.6801, pp.0 - 0, SPIE, 2007-12-05 |
| Chip-to-chip optical link system using an optical wiring method Cho, IK; Ahn, SH; Rho, BS; Chung, KS; Park, HyoHoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.19, no.13-16, pp.1151 - 1153, 2007-07 |
| Compact packaging of optical and electronic components for on-board optical interconnects Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02 |
| Comparative analysis of single-ended and differential receiver modules in 0.13 μm CMOS technology Sangirov, Jamshid; Ukaegbu, Ikechi Augustine; Nguyen, Nga T H; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, 15th International Conference on Advanced Communication Technology, pp.217 - 221, Communications Society, 2013-01-28 |
| Comparison of 1545 nm pump to 1480 nm pump for high power long-wavelength-band erbium-doped fibre amplifier Choi, BH; Park, HyoHoon; Chu, MJ, ELECTRONICS LETTERS, v.39, no.13, pp.970 - 972, 2003-06 |
| Comparison of long- and short-wavelength optical transmitters for optical PCB applications Kim, DW; Shorab Muslima, SM; Ukaegbu, AI; Lee, TW; Cho, MH; Kim, SJ; Yoo, BS; et al, Photonics Packaging, Integration, and Interconnects IX, v.7221, no.0, pp.0 - 0, SPIE, 2009-01-26 |
| Comparison of the amplification characteristics of 1.53um-band and 1.48mm pumped L-band EDFAs Choi, BH; Park, HyoHoon; Chu, MJ; Kim, SK; Lee, S. R.; Lee, J. C.; Park, T. S., OECC, v.0, no.0, pp.0 - 0, OECC, 2000-07-10 |
| Crosstalk analysis of planar and multi-chip transmitter modules for optical PCB applications Ukaegbu, IA; Cho, Mu Hee; Lee, TW; Park, HyoHoon, 9th International Conference on Optical Internet, COIN 2010, COIN 2010, 2010-07-11 |
| Demonstration of 2.5Gb/s optical interconnection using 45째-ended connection blocks in fiber- And waveguide-embedded PCBs Cho H.S.; Rho B.S.; Kang S.; Cho M.H.; Park, HyoHoon; Shin K.-U.; Ha S.-W.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.2, pp.1547 - 1551, Electronic Components and Technology Conference, 2004-06-01 |
| Demonstration of bidirectional optical link on optical PCB using a driver-receiver combined CMOS transceiver Kang, S.K.; Lee, T.W.; Hwang, S.H.; Cho, M.H.; Park, HyoHoon, IEEE 56th Electronic Components and Technology Conference, v.2006, pp.1578 - 1582, 2006-05-30 |
| Design of analog-type high-speed SerDes using digital components for optical chip-to-chip link Sangirov, J; Nguyen, NTH; Ngo, TH; Im, DM; Ukaegbu, AI; Lee, TW; Cho, MH; et al, Optoelectronic Interconnects and Component Integration IX, Optoelectronic Interconnects and Component Integration IX, 2010-01-25 |
| Design of simultaneous bidirectional CMOS transceiver with a resistor-transconductor hybrid for optical chip-to-chip interconnects Ukaegbu, IA; Sangirov, J; Ngo, TH; Lee, Tae Woo; Park, HyoHoon, Physics and Simulation of Optoelectronic Devices XIX, Physics and Simulation of Optoelectronic Devices XIX, 2011-01-24 |
| Design of transimpedance amplifier for optical receivers in 0.13 μm CMOS Ngo, TH; Lee, TW; Park, HyoHoon, 9th International Conference on Optical Internet, COIN 2010, COIN 2010, 2010-07-11 |
| Driver-receiver combined optical transceiver modules for bidirectional optical interconnection Park, HyoHoon; Kang, S.K.; Kim, D.W.; Nga, N.T.H.; Hwang, S.H.; Lee, T.W., Optoelectronic Integrated Circuits X, v.6897, SPIE, 2008-01-21 |
| E/O module integrated with combined Tx/Rx and Mux/Demux Nguyen, NTH; Ngo, TH; Lim, DM; Cho, MH; Lee, TW; Park, HyoHoon, 59th Electronic Components and Technology Conference 2009, pp.2030 - 2033, 2009-05-26 |
| EFFECT OF DIHEDRAL ANGLE ON THE MORPHOLOGY OF GRAINS IN A MATRIX PHASE Park, HyoHoon; Yoon, Duk Yong, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.16, no.5, pp.923 - 928, 1985 |
| EFFECT OF STRESS SIGN AND FILM THICKNESS ON INTERFACE NUCLEATION OF MISFIT DISLOCATIONS IN STRAINED MULTILAYERS Park, HyoHoon; YOO, JB; OH, DK; KIM, JS; Lee, JeongYong, JOURNAL OF APPLIED PHYSICS, v.75, no.10, pp.4990 - 4993, 1994-05 |
| Efficient heat dissipation in optoelectronic transmitter modules using thermally enhanced PCB Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Cho, Mu Hee; Lee, Tae Woo; Park, HyoHoon, OptoElectronics and Communications Conference, Optical Society of Korea, 2012-07-05 |
| Efficient high-speed optoelectronic interconnects parameter extraction based on 3D field simulation Ukaegbu,IA; Lee, TW; Park, HyoHoon, 13th International Conference on Advanced Communication Technology: Smart Service Innovation through Mobile Interactivity, ICACT 2011, pp.244 - 247, ICACT 2011, 2011-02-13 |
| Evaluation and compensation for optically and electrically interconnected signal latencies Muslim S.Md.S.; Lee, T.W.; Park, HyoHoon, 9th IEEE International Conference on Advanced Communication Technology, ICACT 2007, v.3, pp.1556 - 1558, 2007-02-12 |
| Evolution of the surface cross-hatch pattern in InxGa1-xAs/GaAs layers grown by metal-organic chemical vapor deposition Yoon, M; Lee, B; Baek, JH; Park, HyoHoon; Lee, EH; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.68, no.1, pp.16 - 18, 1996-01 |
| Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots Cho, IK; Yoon, KB; Alm, SH; Sung, HK; Ha, SW; Heo, YU; Park, HyoHoon, OPTICS LETTERS, v.30, no.13, pp.1635 - 1637, 2005-07 |
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