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A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002 |
Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity Kim, Joungho; Lee, Heeseok; Park, Bongcheol; Kam, Dong Gun, IEEE 6th Workshop on Signal Propagation on Interconnects, pp.41 - 43, IEEE, 2002 |
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