Browse "School of Electrical Engineering(전기및전자공학부)" by Author Kim, Youngwoo
Showing results 1 to 60 of 74
| A 0.22-0.89 mW Low-Power and Highly-Secure Always-On Face Recognition Processor With Adversarial Attack Prevention Kim, Youngwoo; Han, Donghyeon; Kim, Changhyeon; Yoo, Hoi-Jun, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.67, no.5, pp.846 - 850, 2020-05 |
| A 0.22–0.89 mW Low-Power and Highly-Secure Always-on Face Recognition Processor with Adversarial Attack Prevention Kim, Youngwoo; Yoo, Hoi-Jun; Han, Donghyeon; Kim, Changhyeon, 2020 IEEE International Symposium on Circuits and Systems (ISCAS), Institute of Electrical and Electronics Engineers Inc., 2020-10-21 |
| A 0.95 mJ/frame DNN Training Processor for Robust Object Detection with Real-World Environmental Adaptation Han, Donghyeon; Im, DongSeok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, 4th IEEE International Conference on Artificial Intelligence Circuits and Systems, AICAS 2022, pp.37 - 40, Institute of Electrical and Electronics Engineers Inc., 2022-06 |
| A 2.1TFLOPS/W Mobile Deep RL Accelerator with Transposable PE Array and Experience Compression Kim, Changhyeon; Kang, Sanghoon; Shin, Dongjoo; Choi, Sungpill; Kim, Youngwoo; Yoo, Hoi-Jun, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, pp.136 - 138, Institute of Electrical and Electronics Engineers Inc., 2019-02 |
| A 9.52 ms Latency, and Low-power Streaming Depth-estimation Processor with Shifter-based Pipelined Architecture for Smart Mobile Devices Choi, Sungpill; Lee, Kyuho Jason; Kim, Youngwoo; Yoo, Hoi-Jun, JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v.20, no.3, pp.255 - 270, 2020-06 |
| A DNN Training Processor for Robust Object Detection with Real-World Environmental Adaptation Han, Donghyeon; Im, DongSeok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, 4th IEEE International Conference on Artificial Intelligence Circuits and Systems, AICAS 2022, pp.501, Institute of Electrical and Electronics Engineers Inc., 2022-06 |
| A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application Hong, Seokwoo; Kim, Youngwoo; Lee, Seongsoo; Jeong, Seungtaek; Sim, Boogyo; Kim, Hongseok; Song, Jinwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.2031 - 2039, 2019-12 |
| A Mobile DNN Training Processor With Automatic Bit Precision Search and Fine-Grained Sparsity Exploitation Han, Donghyeon; Im, Dongseok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, IEEE MICRO, v.42, no.2, pp.16 - 24, 2022-03 |
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System Sim, Boogyo; Jeong, Seungtaek; Kim, Youngwoo; Park, Shinyoung; Lee, Seongsoo; Hong, Seokwoo; Song, Jinwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.3, pp.935 - 946, 2021-06 |
| A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10 |
| (A) low-power always-on CNN face recognition processor with adversarial attack prevention = 적대적 공격 방어 가능한 저전력 CNN 얼굴 인식 프로세서link Kim, Youngwoo; Yoo, Hoi-Jun; et al, 한국과학기술원, 2020 |
| An Energy-efficient Deep Neural Network Training Processor with Bit-slice-level Reconfigurability and Sparsity Exploitation Han, Donghyeon; Im, Dongseok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, IEEE Symposium on Low-Power and High-Speed Chips (IEEE COOL CHIPS), IEEE COMPUTER SOC, 2021-04 |
| An Energy-Efficient Deep Reinforcement Learning Accelerator With Transposable PE Array and Experience Compression Kim, Changhyeon; Kang, Sanghoon; Choi, Sungpill; Shin, Dongjoo; Kim, Youngwoo; Yoo, Hoi-Jun, IEEE Solid-State Circuits Letters, v.2, no.11, pp.228 - 231, 2019-11 |
| Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket Park, Junyong; Kim, Hyesoo; Kim, Youngwoo; Kim, Jonghoon J; Bae, Bumhee; Kim, Joungho; Ha, Dongho; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB Kim, Joung-Ho; Kim, Youngwoo; Kim, Kiyeong; Cho, Jonghyun; Sundaram, Venky; Tummala, Rao, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014-08-03 |
| Analysis of Power Inverter Parasitic Inductances Effect on Switching Characteristics for Accurate Electromagnetic Interference (EMI) Estimation Park, Gyeyoung; Kim, Joungho; Song, Jinwook; Jung, Seungtaek; Kim, Youngwoo; Shim, Hyunwoo, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.277 - 282, Institute of Electrical and Electronics Engineers Inc., 2017-08-06 |
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link Kim, Jihun; Kim, Minsu; Kim, Haeyeon; Park, Hyunwook; Choi, Seonguk; Park, Joonsang; Sim, Boogyo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.65, no.6, pp.1751 - 1762, 2023-12 |
| Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor Kim, Dong-Hyun; Kim, Subin; Park, Junyong; Kim, Youngwoo; Choi, Sumin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.40 - 40, IEEE EMC & APEMC, 2018-05-16 |
| Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Subin; Kang, Hyungmin; Sim, Boogyo; Kim, Seongguk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02 |
| Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module Choi, Seonguk; Son, Keeyoung; Park, Hyunwook; Kim, Seongguk; Sim, Boogyo; Kim, Jihun; Park, Joonsang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.11, pp.1804 - 1816, 2023-11 |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; et al, DesignCon 2017, DesignCon 2017, 2017-02-01 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2017-11 |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 |
| Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM) Kim, Joungho; Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Kim, Minsuk; Pulugurtha Markondeya Raj; Venky Sundaram; et al, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 |
| Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.317 - 328, 2019-02 |
| Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission Jeon, Yeseul; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Design of an On-interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission Jeon, Yeseul; Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Youngwoo, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| Design, simulation and measurement of a flexible voltage-controlled oscillator (VCO) chip with bending radius Jeong, Seungtaek; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Park, Hyunwook; Kim, Subin; Kim, Youngwoo; et al, IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE, 2020-10 |
| Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV) Kim, Jihye; Hwang, Insu; Kim, Youngwoo; Kim, Heegon; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.93 - 96, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.3 - 5, IEEE, 2018-10-15 |
| Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 |
| Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer Kim, Joungho; Kim, Youngwoo; Song, Jinwook; Kim, Subin; Venky, Sundaram; Ao, Tummala; Cho, Jonghyun, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; Kim, Dong-Hyun; Jeong, Seung Taek; Cho, Yeonje; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09 |
| Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM4 Signal on Stacked Through-Silicon Vias (TSVs) Park, Junyong; Kim, Jonghoon J.; Choi, Sumin; Kim, Youngwoo; Kim, Joungho; Kim, Heegon, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1724 - 1731, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel Park, Junyong; Kim, Dong-Hyun; Kim, Youngwoo; Choi, Sumin; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), IEEE EMC & APEMC, 2018-05-16 |
| Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; Park, Hyunwook; Park, Junyong; Lee, Seongsoo; Shim, Daeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09 |
| Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 |
| Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 |
| Hierarchical Power Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Kim, Subin, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites Watanabe, Atom O; Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Min, Junki; Wong, Denny; Pulugurtha, Markondeya R.; et al, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, pp.206 - 210, Institute of Electrical and Electronics Engineers Inc., 2016-05 |
| HNPU-V2: A 46.6 FPS DNN Training Processor for Real-World Environmental Adaptation based Robust Object Detection on Mobile Devices Han, Donghyeon; Im, DongSeok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, 2022 IEEE Hot Chips 34 Symposium, HCS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08 |
| HNPU: An Adaptive DNN Training Processor Utilizing Stochastic Dynamic Fixed-Point and Active Bit-Precision Searching Han, Donghyeon; Im, Dongseok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.56, no.9, pp.2858 - 2869, 2021-09 |
| How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones Kim, Joungho; Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo, DesignCon 2018, DesignCon 2018, 2018-01-31 |
| Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
| Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC Kim, Joung-Ho; Song, Eunseok; Jung, Daniel H.; Kim, Youngwoo, 2014 International Symposium on Electromagnetic Compatability, Tokyo(EMC2014), 2014 International Symposium on Electromagnetic Compatability, Tokyo(EMC2014), 2014-05-15 |
| Miniaturized and high-performance RF packages with ultra-thin glass substrates Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; Park, Gap Yeol; Cho, Kyungjun; Smet, Vanessa; Sundaram, Venky; et al, MICROELECTRONICS JOURNAL, v.77, pp.66 - 72, 2018-07 |
| Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules Sitaraman, Srikrishna; Sukumaran, Vijay; Pulugurtha, Markondeya Raj; Wu, Zihan; Suzuki, Yuya; Kim, Youngwoo; Sundaram, Venky; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1410 - 1418, 2017-09 |
| Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Modeling and analysis of power distribution network in 2.5D and 3D IC based on segmentation method and target impedance considering current spectrum = 구조분할 방법과 전류 스펙트럼에 기반한 목표 임피던스를 이용한 2.5차원/3차원 반도체에서 전력분배망의 모델링 및 분석link Kim, Youngwoo; 김영우; et al, 한국과학기술원, 2015 |
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
| Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Joungho, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04 |
| Noise Coupling Modeling and Analysis of Through Glass Via(TGV) Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling Park, Junyong; Park, Shinyoung; Kim, Youngwoo; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1867 - 1875, 2019-12 |
Discover
Open Access
- 573 OA Article
Date issued
- 4,909 2020 - 2024
- 18,937 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989