Browse "School of Electrical Engineering(전기및전자공학부)" by Author Iyer M.K.
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| Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs Lee J.; Kim H.; Kim, Joungho; Rotaru M.D.; Iyer M.K., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.2, pp.298 - 309, 2005-05 |
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