Browse "School of Electrical Engineering(전기및전자공학부)" by Author Im, DongSeok

Showing results 1 to 11 of 11

1
A 0.95 mJ/frame DNN Training Processor for Robust Object Detection with Real-World Environmental Adaptation

Han, Donghyeon; Im, DongSeok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, 4th IEEE International Conference on Artificial Intelligence Circuits and Systems, AICAS 2022, pp.37 - 40, Institute of Electrical and Electronics Engineers Inc., 2022-06

2
A 4.45 ms Low-Latency 3D Point-Cloud-Based Neural Network Processor for Hand Pose Estimation in Immersive Wearable Devices

Im, DongSeok; Yoo, Hoi-Jun; Kang, Sanghoon; Han, Donghyeon; Choi, Sungpill, IEEE Symposium on VLSI Circuits, VLSI Circuits 2020, Institute of Electrical and Electronics Engineers Inc., 2020-06-16

3
A DNN Training Processor for Robust Object Detection with Real-World Environmental Adaptation

Han, Donghyeon; Im, DongSeok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, 4th IEEE International Conference on Artificial Intelligence Circuits and Systems, AICAS 2022, pp.501, Institute of Electrical and Electronics Engineers Inc., 2022-06

4
AI SoCs for AR/VR User-Interaction

Ryu, Junha; Im, DongSeok; Yoo, Hoi-Jun, 2021 IEEE International Electron Devices Meeting (IEDM), IEEE, 2021-12-11

5
An Efficient Deep-Learning-Based Super-Resolution Accelerating SoC With Heterogeneous Accelerating and Hierarchical Cache

Li, Zhiyong; Kim, Sangjin; Im, DongSeok; Han, Donghyeon; Yoo, Hoi-Jun, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.58, no.3, pp.614 - 623, 2023-03

6
An Efficient High-quality FHD Super-resolution Mobile Accelerator SoC with Hybrid-precision and Energy-efficient Cache

Li, Zhiyong; Yoo, Hoi-Jun; Kim, Sangjin; Im, DongSeok; Han, Donghyeon, 2022 IEEE Hot Chips 34 Symposium, HCS 2022, pp.1 - 26, Institute of Electrical and Electronics Engineers Inc., 2022-08

7
An Efficient Unsupervised Learning-based Monocular Depth Estimation Processor with Partial-Switchable Systolic Array Architecture in Edge Devices

Park, Wonhoon; Yoo, Hoi-Jun; Im, DongSeok; Kwon, Hankyul, 2022 IEEE Asian Solid-State Circuits Conference, A-SSCC 2022, Institute of Electrical and Electronics Engineers Inc., 2022-11

8
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip

Im, DongSeok; Park, Gwangtae; Li, Zhiyong; Ryu, Junha; Kang, Sanghoon; Han, Donghyeon; Lee, Jinsu; et al, 2022 IEEE Hot Chips 34 Symposium, HCS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08

9
DSPU: A 281.6mW Real-Time Depth Signal Processing Unit for Deep Learning-Based Dense RGB-D Data Acquisition with Depth Fusion and 3D Bounding Box Extraction in Mobile Platforms

Im, DongSeok; Park, Gwangtae; LI, ZHIYONG; Ryu, Junha; Kang, Sanghoon; Han, Donghyeon; Lee, Jinsu; et al, 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022, pp.510 - 512, Institute of Electrical and Electronics Engineers Inc., 2022-02

10
GANPU: A Versatile Many-Core Processor for Training GAN on Mobile Devices with Speculative Dual-Sparsity Exploitation

Kang, Sanghoon; Yoo, Hoi-Jun; Han, Donghyeon; LEE, JUHYOUNG; Im, DongSeok; Kim, Sangyeob; Kim, Soyeon; et al, Hot Chips: A Symposium on High Performance Chips, IEEE Technical Committee on Microprocessors and Microcomputers., 2020-08-16

11
HNPU-V2: A 46.6 FPS DNN Training Processor for Real-World Environmental Adaptation based Robust Object Detection on Mobile Devices

Han, Donghyeon; Im, DongSeok; Park, Gwangtae; Kim, Youngwoo; Song, Seokchan; Lee, Juhyoung; Yoo, Hoi-Jun, 2022 IEEE Hot Chips 34 Symposium, HCS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08

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