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Body-temperature softening electronic ink for additive manufacturing of transformative bioelectronics via direct writing Kwon, Do A.; Lee, Simok; Kim, Choongyeon; Kang, Inho; Park, Steve; Jeong, Jae-Woong, SCIENCE ADVANCES, v.10, no.9, 2024-02 |
Universal assembly of liquid metal particles in polymers enables elastic printed circuit board Lee, Wonbeom; Kim, Hyunjun; Kang, Inho; Park, Hongjun; Jung, Jiyoung; Lee, Hae-Seung; Park, Hyunchang; et al, SCIENCE, v.378, no.6620, pp.637 - 641, 2022-11 |
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