Showing results 65 to 74 of 74
Segmentation method based modeling and analysis of a glass package power distribution network (PDN) Kim, Youngwoo; Fujimoto, Daisuke; Kaji, Shugo; Wada, Shinpei; Park, Hyunwook; Lho, Daehwan; Kim, Joungho; et al, IEICE NONLINEAR THEORY AND ITS APPLICATIONS, v.11, no.2, pp.170 - 188, 2020-04 |
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11 |
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08 |
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Song, Jinwook; Park, Junyong; Lee, Seongsoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01 |
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09 |
Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity Kim, Youngwoo; Fujimoto, Daisuke; Nishiyama, Hikaru; Hayashi, Yu-Ichi; Lho, Daehwan; Park, Hyunwook; Kim, Joungho, 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019, pp.138 - 140, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems Das, Mumpy; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Hong, Seokwoo; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 |
Suppression of Power Distribution Network(PDN) Resonances in Glass Interposer Kim, Joungho; Kim, Youngwoo; Cho, Jonghyun, Global Interposer Workshop 2013, Global Interposer Workshop 2013 in Georgia Institute of Technology, 2013-11-17 |
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
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