Browse "School of Electrical Engineering(전기및전자공학부)" by Author Bae, Hyun-Cheol
Showing results 6 to 6 of 6
| Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
Discover
Open Access
- 573 OA Article
Date issued
- 4,871 2020 - 2024
- 18,943 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989