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Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics Lee, Gun-Hee; Kim, Hyeonji; Lee, Juhyun; Bae, Jae-Young; Yang, Congqi; Kim, Hanul; Kang, Heemin; et al, MATERIALS TODAY, v.67, pp.84 - 94, 2023-07 |
Universal assembly of liquid metal particles in polymers enables elastic printed circuit board Lee, Wonbeom; Kim, Hyunjun; Kang, Inho; Park, Hongjun; Jung, Jiyoung; Lee, Hae-Seung; Park, Hyunchang; et al, SCIENCE, v.378, no.6620, pp.637 - 641, 2022-11 |
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