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Showing results 1 to 5 of 5

1
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10

2
Nonvolatile memory based on sol-gel ZnO thin-film transistors with Ag nanoparticles embedded in the ZnO/gate insulator interface

Gupta, Dipti; Anand, Manish; Ryu, Seong-Wan; Choi, Yang-Kyu; Yoo, Seunghyup, APPLIED PHYSICS LETTERS, v.93, no.22, 2008-12

3
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08

4
Surface plasmon-enhanced spontaneous emission rate in an organic light-emitting device structure: Cathode structure for plasmonic application

Yang, Ki Youl; Choi, Kyung Cheol; Ahn, Chi Won, APPLIED PHYSICS LETTERS, v.94, no.17, 2009-04

5
유기발광소자를 위한 유연성과 열전도 특성을 가지는 금속박막이 삽입된 다층 박막 봉지 = The metal-containing thin film encapsulation with flexibility and heat transfer porperties for Organic Light-Emitting diodelink

권정현; Kwon, JeongHyun; et al, 한국과학기술원, 2015

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