Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 36881 to 36900 of 51043
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |
| Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations Kim, Tae-Joon; Lim, Jong-Tae, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03 |
| THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX KIM, SR; Un, Chong-Kwan, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11 |
| Throughput analysis of 1x EV-DO system with multi cells Choi, Wan; Choi, D.; Lee, J.; Lee, S., IEICE International Technical Conference on Circuit/Systems, Computer, and Communications (ITC-CSCC), pp.1924 - 1927, ITC-CSCC, 2002-07-16 |
| Throughput analysis of a DS/SSMA unslotted ALOHA system with two user classes So, Jae Woo; Cho, Dong-Ho, International Conference on Communications (ICC2001), pp.1985 - 1989, IEEE, 2001-06-11 |
| THROUGHPUT ANALYSIS OF CHANNEL LOAD SENSE MULTIPLE ACCESS WITH OVERLOAD DETECTION PROTOCOL IN SPREAD SPECTRUM PACKET RADIO NETWORKS LIM, DM; Lee, Hwang Soo, ELECTRONICS LETTERS, v.27, no.20, pp.1809 - 1810, 1991-09 |
| Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism Lee, IG; Yoo, Hyung Joun; Park, Sin Chong, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.1, pp.402 - 407, 2005-01 |
| Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism Lee I.-G.; Yoon S.-R.; Park, Sin Chong, IEEE International Symposium on Communications and Information Technologies: Smart Info-Media Systems, ISCIT 2004, v.1, pp.290 - 295, 2004-10-26 |
| Throughput and Delay Performance of DSL Broadband Access with Cross-Layer Dynamic Spectrum Management Tsiaflakis, Paschalis; Yi, Yung; Chiang, Mung; Moonen, Marc, IEEE TRANSACTIONS ON COMMUNICATIONS, v.60, no.9, pp.2700 - 2711, 2012-09 |
| Throughput and Delay performance of Dynamic Spectrum Management over DSL Arrivals Yi, Yung; Tsiaflakis, Paschalis; Chiang, Mung; Moonen, Marc, IEEE Globecom, IEEE, 2008-11 |
| Throughput Characteristics by Multiuser Diversity in a Cognitive Radio System Hong, Jun-Pyo; Choi, Wan, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.59, no.8, pp.3749 - 3763, 2011-08 |
| Throughput Comparisons of Single- and Two-Hop Celluar Systems with Single or Multiple Antennas Sung, Dan Keun; Yoon, S.H.; Baek, S.Y.; Ban, T.W., JCCI 2009, 2009-04 |
| Throughput Efficiency of LAPB/D Protocol with Multi-Reject Error Recovery Procedure W.Y.Jung; C.K.Un, ELECTRONICS LETTERS, v.25, no.19, pp.1318 - 1320, 1989-09 |
| Throughput enhancement for short packets in the wireless packet networks Kwon, Y.-H.; Oh, M.-K.; Park, Dong-Jo, 2004 7th International Conference on Signal Processing Proceedings (ICSP'04), v.3, pp.1833 - 1836, 2004-08-31 |
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