Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 36841 to 36860 of 51062
| Three-Dimensional Blood Vessel Quantification via Centerline Deformation Kang, Dong-Goo; Suh, Dae Chul; Ra, Jong Beom, IEEE TRANSACTIONS ON MEDICAL IMAGING, v.28, pp.405 - 414, 2009-03 |
| Three-dimensional electro-floating display system using an integral imaging method Min, SW; Hahn, Minsoo; Kim, J; Lee, B, OPTICS EXPRESS, v.13, pp.4358 - 4369, 2005-06 |
| Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor Lee, Dong-Il; Lee, Byung-Hyun; Yoon, Jinsu; Ahn, Dae-Chul; Park, Jun-Young; Hur, Jae; Kim, Myung-Su; et al, ACS NANO, v.10, no.12, pp.10894 - 10900, 2016-12 |
| Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network Shin, Changyeop; Ryu, Hyun; Cho, Eun-Seo; Han, Seungjae; Lee, Kang-Han; Kim, Cheol-Hee; Yoon, Young-Gyu, MEDICAL IMAGE ANALYSIS, v.82, 2022-11 |
| Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network = 3차원 형광영상 복원을 위한 딥러닝 기반 가상 재초점 기술 연구link Shin, Changyeop; Yoon, Young-Gyu; et al, 한국과학기술원, 2022 |
| Three-Dimensional Integration Approach to High-Density Memory Devices Kim, Hojung; Jeon, Sanghun; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11 |
| Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
| Three-dimensional microstructure technology for microfluidic systems and integrated inductors = 미소유체 시스템과 집적 인덕터를 위한 3차원 미소구조체 기술link Yoon, Jun-Bo; 윤준보; et al, 한국과학기술원, 1999 |
| Three-dimensional nanopillar-array photovoltaics on low-cost and flexible substrates Fan, Zhiyong; Razavi, Haleh; Do, Jae-won; Moriwaki, Aimee; Ergen, Onur; Chueh, Yu-Lun; Leu, Paul W.; et al, NATURE MATERIALS, v.8, no.8, pp.648 - 653, 2009-08 |
| Three-dimensional phase-field based quantum transport simulations of polar topological states Lee, Hyeongu; Shin, Mincheol, 2023 International Electron Devices Meeting (IEDM), Institute of Electrical and Electronics Engineers Inc., 2023-12-12 |
| Three-dimensional quantum simulation of multigate nanowire field effect transistors Shin, Mincheol, MATHEMATICS AND COMPUTERS IN SIMULATION, v.79, no.4, pp.1060 - 1070, 2008-12 |
| Three-dimensional solar steam generation device with additional non-photothermal evaporation Kim, Kwanghyun; Yu, Sunyoung; Kang, Se-Young; Ryu, Seung-Tak; Jang, Ji-Hyun, DESALINATION, v.469, 2019-11 |
| Three-dimensional volume image reconstruction with cone beam projections = 원추형 방사선 투영 정보를 이용한 3차원 영상 재구성link Min, Hyoung-Bok; 민형복; et al, 한국과학기술원, 1982 |
Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids Park, Yoonseok; Franz, Colin K.; Ryu, Hanjun; Luan, Haiwen; Cotton, Kristen Y.; Kim, Jong Uk; Chung, Ted S.; et al, SCIENCE ADVANCES, v.7, no.12, 2021-03 |
| Three-dimensionally patterned Ag-Pt alloy catalyst on planar Si photocathodes for photoelectrochemical H-2 evolution Lim, Sung Yul; Ha, Kyungyeon; Ha, Heonhak; Lee, Soo Youn; Jang, Min Seok; Choi, Mansoo; Chung, Taek Dong, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.21, no.8, pp.4184 - 4192, 2019-01 |
| Three-electrode gas sensor system using CMOS interface IC = CMOS 인터페이스 IC 를 이용한 금속 산화물 기반 3-전극 가스센서 시스템link Park, Jeong-Ho; 박정호; et al, 한국과학기술원, 2017 |
| Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ook; Yoo, Hyung-Joun, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02 |
| Three-Level Capacitor Clamping Single Sustaining Driver With Dual Energy Recovery Path for Low Cost AC Plasma Display Panel Choi, SW; Moon, GunWoo, JOURNAL OF DISPLAY TECHNOLOGY, v.5, pp.398 - 407, 2009-10 |
| Three-level differential buffer for increasing noise margin in pseudo-differential signalling Ha, K. -S.; Kim, Lee-Sup; Bae, S. -J.; Park, K. -I.; Choi, J. S.; Jun, Y. -H., ELECTRONICS LETTERS, v.46, no.21, pp.1429 - 1430, 2010-10 |
| Three-level LLC SRC for high and wide input voltage applications Lee, Il Oun; Moon, GunWoo, Power Electronics and ECCE Asia (ICPE & ECCE), 2011 IEEE 8th International Conference on, pp.52 - 59, IEEE, 2011-05-30 |
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