Browse "School of Electrical Engineering(전기및전자공학부)" by Title 

Showing results 26541 to 26560 of 51624

26541
Multi-layer high-kappa interpoly dielectric for floating gate flash memory devices

Zhang, L; He, W; Chan, DSH; Cho, Byung Jin, SOLID-STATE ELECTRONICS, v.52, pp.564 - 570, 2008-04

26542
Multi-layer insulator for low voltage and breakdown voltage enhancement in electrowetting-on-dielectric

Hapsari, Anggita; Won, Yong-Hyub, SPIE Photonics West 2014, SPIE, 2014-02-03

26543
Multi-Layer Metallization Structure Development for Highly Efficient Polycrystalline SnSe Thermoelectric Devices

Kim, Yeongseon; Yoon, Gi-Wan; Cho, Byung-Jin; Park, Sang Hyun, APPLIED SCIENCES, v.7, no.11, 2017-11

26544
Multi-layer nanogap array for high-performance SERS substrate

Seol, Myeong-Lok; Kim, Ju-Hyun; Kang, Tae-Joon; Im, Hwon; Kim, Sung-Ho; Kim, Bong-Soo; Choi, Yang-Kyu, NANOTECHNOLOGY, v.22, no.23, pp.235303 - 235307, 2011-04

26545
Multi-Layer Neural Network with Hybrid Learning Rules for Improved Robust Capability

이수영, TRANS. KOREAN INST. TELEM. ELECT.,, no.8, pp.1238 - 1245, 1994-01

26546
Multi-layer optical neural classifiers based on fractional Fourier transforms

Park, Cheol Hoon; Lee, Soo-Young; Bae, Y.S.; Jin, S.; Shin, S., OECC'97, pp.8 - 11, 1997

26547
Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel

Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27

26548
Multi-layered architecture of middleware for ubiquitous robot

Jeong, I.-B.; Kim, Jong-Hwan, 2008 IEEE International Conference on Systems, Man and Cybernetics, SMC 2008, pp.3479 - 3484, IEEE, 2008-10-12

26549
Multi-layered atlas registrations for multi-atlas segmentation of brain MRI

Lee, Han Sang; Kim, Junmo, Ann. Meet. Intl. Soc. Mag. Res. Med. (ISMRM 2016), The International Society for Magnetic Resonance in Medicine (ISMRM), 2016-05

26550
Multi-layered Global Path Planning to Solve Path Mismatch Problem of Integrating Global Path Planning and Local Path Planning

Seok, Joon-Hong; Lee, Joon-Woo; Wang, Jeong-Hyun; Lee, Ju-Jang; Lee, Ho Joo, 8th International Conference on Humanized Systems 2012, pp.357 - 362, IEEE, 2012-08-16

26551
Multi-layered Integrated Path Planning for Solving Path Mismatch Problem

Seok, Joon-Hong; Lee, Joon-Woo; Wang, Jeong-Hyun; Lee, Ju-Jang; Lee, Ho Joo, 2012 IEEE/SICE International Symposium on System Integration, IEEE/SICE, 2012-12-16

26552
Multi-layered multi-band antenna

Park, SeongOok, 2006-05-30

26553
Multi-layered organic devices using stamped active layers from water

Lee, Jung-Yong, The 10th Asian Conference on Organic Electronics (A-COE 2018), City University of Hong Kong, 2018-12-05

26554
Multi-layered organic solar cells using spontaneous spreading process

이정용, Nano Korea 2018, Nano Korea, 2018-07-10

26555
Multi-Layered Polymer Solar Cells using Stamped Active Layers from Water

Lee, Jung-Yong, 2019 MRS Spring Meeting & Exhibit, Materials Research Society, 2019-04-24

26556
Multi-layered polymer solar cells utilizing spontaneous spreading process

Lee, Jung-Yong, International Conference on Science and Technology of Synthetic Metals (ICSM) 2018, ICSM 2018 Organizing Committee, 2018-07-01

26557
Multi-level active clamp forward converter with reduced voltage stress

Park, K.-B.; Kim, C.-E.; Moon, G.-W.; Youn, Myung Joong, PESC '08 - 39th IEEE Annual Power Electronics Specialists Conference, pp.938 - 943, 123, 2008-06-15

26558
Multi-Level Active-Clamp Forward Converter

Park, Ki-Bum; Kim, Chong-Eun; Moon, Gun-Woo; Youn, MyungJoong, 2007년 전력전자학술대회, pp.188 - 189, KIPE, 2007-07-02

26559
Multi-Level Active-Clamp Forward Converter with Reduced Voltage Stress

Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung-Joong, Power Electronics Specialists Conference, 2008. PESC 2008. IEEE, pp.938 - 943, IEEE, 2008-06-15

26560
Multi-level dirty paper coding

Chung, Sae-Young, IEEE COMMUNICATIONS LETTERS, v.12, no.6, pp.456 - 458, 2008-06

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