Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 4401 to 4420 of 22813
| Analysis of thermal effects on crosstalk and performance of optoelectronic transmitter modules Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Lee, Tae Woo; Cho, Mu Hee; Park, HyoHoon, OptoElectronics and Communications Conference, Optical Society of Korea, 2012-07-05 |
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Analysis of throughput and efficient block size based polling scheme for IEEE 802.11e Wireless LANs Lee I.-G.; Yoon S.-R.; Park, Sin Chong, 2005 IEEE International Conference on Communications, ICC 2005, v.5, pp.3467 - 3473, 2005-05-16 |
| Analysis of throughput and energy consumption in a ZigBee network under the presence of bluetooth interference Chong, J.W.; Hwang, H.Y.; Jung, C.Y.; Sung, Dan Keun, 50th Annual IEEE Global Telecommunications Conference, GLOBECOM 2007, pp.4749 - 4753, 2007-11-26 |
| Analysis of throughput in a ZigBee network under the presence of WLAN interference Chong, J.W.; Hwang, H.Y.; Jung, C.Y.; Sung, Dan Keun, ISCIT 2007 - 2007 International Symposium on Communications and Information Technologies, pp.1166 - 1170, 2007-10-16 |
| Analysis of Transmission Line Discontinuities by 3-Dimensional Finite-Element Method Lee, S.S.; Ahn, C.H.; Jeong, B.S; Lee, Soo-Young; Ra, J.W., IEEE MTT Korea Chapter Seminar, 1990-11 |
| Analysis of transmission through slit and multiple grooves structures for biosensors Kim, Bong Ho; Nakarmi, Bikash; Won, Yong Hyub, SPIE Photonics West 2015, SPIE, 2015-02-08 |
| Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs Song, T; Liu, C; Kim, DH; Lim, SK; Cho, J; Kim, J; Pak, JS; et al, 12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128, ISQED 2011, 2011-03-14 |
| Analysis of ultimate capacity and transparency cost of all-optical transport networks based on node throughput Kim, HD; Lee, Chang-Hee, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.4, pp.1285 - 1286, 1999-08-30 |
| Analysis of Uplink Co-Channel Interference on the Cellular Networks Bae, Jimin; Park, Eunhye; Han, Youngnam, 88th IEEE Vehicular Technology Conference (VTC-Fall), IEEE, 2018-08 |
| Analysis of vertical handover latency for IEEE 802.21-enabled Proxy Mobile IPv6 Song, H.; Kim, J.; Lee, J.; Lee, Hwang Soo, 13th International Conference on Advanced Communication Technology: Smart Service Innovation through Mobile Interactivity, ICACT 2011, pp.1059 - 1063, ICACT 2011, 2011-02-13 |
| Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 |
| Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages Kim, Joungho; Kim, Hyungsoo; Kim, Jingook; Jeong, Youchul; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174, IEEE, 2002-10 |
| Analysis of Wall Charge Distribution in an AC PDP with an Auxiliary Electrode Using a Two-Dimensional Numerical Simulation Choi, Kyung Cheol; Kim, ES; Bae, HS, International Symposium on Society for Information Display, pp.1591 - 1594, International Symposium on Society for Information Display, 2010-05 |
| Analysis of weak signal detectors under moving average of impulsive noise Oh, J.; Kang, H.G.; Song, Iickho; Park, S.R.; Bae, J.; Park, J., 2006 IEEE 64th Vehicular Technology Conference, VTC-2006 Fall, pp.1443 - 1447, IEEE, 2006-09-25 |
| Analysis of Wireless Power Transfer System Design on Active Silicon Interposer for Low Voltage Applications in 3D-IC Kim, Joung-Ho; Song, JW; Kim, Sukjin; Bae, Bumhee; Kim, Hongseok; Kim, Jonghoon J.; Kim, Dong-Hyun Bill, 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014), 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014), 2014-10-26 |
| Analysis on D-stability of a Class of Fuzzy Systems Bien, Zeung nam, IEEE World Contress on Computational Intelligence, pp.591 - 597, 1998 |
| Analysis on half-bridge LLC resonant converter by using variable inductance for high efficiency and power density server power supply Jeong, Yeonho; Kim, Jae-Kuk; Moon, Gun-Woo, 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017, pp.170 - 177, Institute of Electrical and Electronics Engineers Inc., 2017-03-30 |
| Analysis on multiple access for heterogeneous network diversity Choi, Y.; Koumadi, K.M.; Kim, S.; Han, Youngnam, VTC Spring 2009 - IEEE 69th Vehicular Technology Conference, IEEE, 2009-04-26 |
| Analysis on resonator coupling and its application to CMOS quadrature VCO at 8 GHz Baek, D.; Song, T.; Ko, S.; Yoon, E.; Hong, Songcheol, 2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, pp.85 - 88, 2003-06-08 |
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