Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference

Showing results 18061 to 18080 of 22800

18061
Thermal signature: a simple yet accurate thermal index for floorplan optimization

Kung, J; Han, I; Sapatnekar, S; Shin, Youngsoo, 48th ACM/IEEE/EDAC Design Automation Conference (DAC), pp.108 - 113, ACM Special Interest Group on Design Automation (SIGDA), 2011-06-08

18062
Thermal signature: 자동 floorplanning을 위한 빠르고 정확한 온도 지표

신영수, 한국반도체학술대회, 한국반도체학회, 2011

18063
Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs

Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; et al, DesignCon 2022, IEEE, 2022-04-07

18064
Thermal-aware energy minimization of 3D-stacked L3 cache with error rate limitation

Yun, W.; Kang, K.; Kyung, Chong-Min, 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011, pp.1672 - 1675, IEEE, 2011-05-15

18065
Thermal-Infrared based Drivable Region Detection

Yoon, Jaeshin; Park, Kibaek; Hwang, Soonmin; Kim, Namil; Choi, Yukyung; Rameau, Francois; Kweon, In So, 2016 IEEE Intelligent Vehicles Symposium, pp.978 - 985, 2016 IEEE Intelligent Vehicles Symposium, 2016-06-21

18066
Thermally stable and low loss optical waveguide using optical-fiber-embedded epoxy matrix for optical printed-circuit board applications

Im, Dong-Min; Kim, Jong-Hun; Cho, Mu Hee; Park, HyoHoon, SPIE Photonics West, SPIE Photonics West, 2010-01-27

18067
Thermally stable and low-loss optical waveguide using optical-fiber- embedded epoxy matrix for optical printed-circuit board applications

Im, DM; Kim, JH; Cho, MH; Kim, DW; Kim, SJ; Choi, JB; Park, HyoHoon, Optoelectronic Interconnects and Component Integration IX, Optoelectronic Interconnects and Component Integration IX, 2010-01-25

18068
Thermally stable lithium niobate integrated-optic voltage sensor with variable sensing ranges

Yim, YS; Shin, Sang Yung, 13th International Conference on Optical Fiber Sensors, pp.232, 13th International Conference on Optical Fiber Sensors, 1999-04

18069
Thermally stable polymeric waveguide using UV-curable epoxy resins for optical printedcircuit board

Kim, DW; Ahn, SH; Cho, IK; Im, DM; Shorab Muslim, SM; Park, HyoHoon, 11th International Conference on Advanced Communication Technology, ICACT 2009, v.2, pp.1430 - 1432, ICACT, 2009-02-15

18070
Thermally-Responsive Softening Intravenous Needle for Enhancement of Patient Care and Healthcare Provider Safety

Agno, Karen-Christian; Yang, Keungmo; Byun, Sanghyuk; OH, SUBIN; Lee, Simok; Kim, Heesoo; Kim, kyurae; et al, 2023 MRS Spring Meeting & Exhibit, Materials Research Society, 2023-04-14

18071
Thermo-optic tunable grating structure for coupler and radiator applications in silicon

Kim, Seong-Hwan; Kim, Jong Hun; Yeo, Sanggu; Kang, Geumbong; Kim, Jeongyoon; Yoo, Dongeun; Lee, Harin; et al, SPIE Photonics West 2017, SPIE, 2017-02-01

18072
Thermoacoustic Loudspeaker Using N-doped Reduced Graphene Oxide Aerogel

김충선; 이경은; 김상욱; 최정우; 조병진, The 3rd Korean Graphene Symposium, 한국그래핀연구회, 2016-04-15

18073
Thermoelectric Characteristics of Si/silicide Heterostructure Layers Fabricated by RF Magnetron Sputtering and RTA Techniques

Ha, Jae Kwon; Jeon, Buil; Yoon, Giwan, IUMRS-ICEM 2018, International Union of Materials Research Societies, The Materials Research Society of Korea, 2018-08-21

18074
Thermoelectric characteristics of silicon/silicide hetero-junction structured thermoelectric modules

Choi, Won Chul; Zyung, Taehyoung; Kim, Soojung; Jeon, Hyojin; Shin, Min-Cheol; Jang, Moongyu, NANO KOREA 2014, NANO KOREA, 2014-07-03

18075
Thermoelectric Characterization of Si/Silicide-Heterostructure Layers Fabricated by RF Magnetron Sputtering

이지화; 하재권; 윤종세; 윤기완, 2017년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2017-11-16

18076
Thermoelectric effect of silicide and silicon hetero-junction structured devices

Wonchul Choi; Shin, Mincheol, E-MRS 2013 SPRING MEETING, E-MRS, 2013-05-27

18077
Thermoelectric Properties of p-type Sb2Te3 and n-type Bi2Te3 Thick Films Deposited by Screen-Printing Technique

Kim, Sun Jin; We, Ju Hyung; Kim, Gyung Soo; Cho, Byung Jin, 2nd ENGE 2012 (Int'l Conference on Electrical Materials and Nanotechnology for Green Environment), The korean Institute of Metals and Materials, 2012-09-19

18078
Thermoelectric properties of silicide/silicon hetero-junction structure

Choi, Wonchul; Park, Young Sam; Huyn, Younghoon; Zyung, Taehyoung; Kim, Jaehyun; Kim, Soojung; Hyojin Jeon; et al, ENGE-12, 2012-09-18

18079
Thermoelectric Properties of the Pt silicide/silicon Laminate Structured p-type Devices

Choi, Wonchul; Shin, Mincheol, 한국물리학회 2013 가을 학술논문 발표회, 한국물리학회, 2013-10-30

18080
Thermopower of Si nanowires under strong impurity scattering

Oh, Jung Hyun; Shin, Mincheol; Lee, Seok-Hee, 18th international conference on electron dynamics in semiconductors, optoelectronics, Univ. of Tokyo, 2013-07-23

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