Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 34221 to 34240 of 51409
| Signal detection and channel estimation for pilot-aided CDMA systems = 파일럿 도움 CDMA 시스템을 위한 신호 검파 및 채널 추정link Hong, Seung-Chul; 홍승철; et al, 한국과학기술원, 2002 |
| Signal detection and sequential estimation techniques for DS/CDMA code acquisition systems = 직접수열 부호분할 다중접속 부호획득 시스템에 알맞은 신호검파 기법과 순차추정기법link Yoon, Seok-Ho; 윤석호; et al, 한국과학기술원, 2002 |
| Signal detection based on log-likelihood ratio in OFDM systems with frequency offset Chang, K.; Kim, H.; Han, Youngnam, 2004 IEEE 60th Vehicular Technology Conference, VTC2004-Fall: Wireless Technologies for Global Security, v.60, pp.3383 - 3387, IEEE, 2004-09-26 |
| Signal detection in various disturbance models = 여러가지 교란모형에서의 신호검파link Bae, Jin-Soo; 배진수; et al, 한국과학기술원, 1998 |
| Signal detection problems : classical and fuzzy set theoretic approaches = 신호검파 : 고전적 접근과 퍼지 집합 이론적 접근link Son, Jae-Cheol; 손재철; et al, 한국과학기술원, 1992 |
| Signal detection using log-likelihood ratio based sorting QR decomposition for V-BLAST systems Lee, HyuckJae; Jeon, H.; Jung, H.; Lee, H., 2007 IEEE 65th Vehicular Technology Conference - VTC2007-Spring, pp.1881 - 1885, IEEE, 2007-04-22 |
| Signal detection using suboptimum quantization in additive noise = 가산성 잡음에서 준최적 양자화를 이용한 신호 검파link Oh, Taek-Sang; 오택상; et al, 한국과학기술원, 1991 |
| Signal generation and stabilization techniques for sub-THz transceivers = 서브 테라헤르츠 송수신기를 위한 신호 발생 및 안정화 기술link Moon, Byeong-Taek; Lee, Sang-Gug; et al, 한국과학기술원, 2023 |
| Signal integrity (SI) design and analysis of network-on-chip (NoC) of full wafer scale chip (FWSC) for ultra-large scale ai supercomputer = 인공지능 슈퍼컴퓨터를 위한 FWSC의 NoC에 대한 신호 무결성 설계 및 분석link Kim, Juneyoung; 김준영; et al, 한국과학기술원, 2024 |
| Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig Kim, Joungho; Kim, Hyesoo; Park, Shinyoung; Kim, Jonghoon; Park, Jung-Min; Kim, UnHo; Jeon, YuckHwan, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-15 |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Signal Integrity Analysis of High Speed Connector for Multi-Media System Kim, Joungho; Song, Huijin; Kim, Jonghoon; Park, Junyong; Lee, Junho; Choi, Seongmin, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Signal Integrity Analysis of High-Speed Board-to-Board Floating Connectors for Automotive Systems Kim, Joungho; Park, Shinyoung; Kim, Hyesoo; Kim, Jonghoon; Kim, Unho; Park, Jungmin; Jeon, Yuckhwan, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, 2017-10-17 |
| Signal Integrity Analysis of Machine Pressed Coaxial Connector for Automotive System Kim, Joungho; Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Jonghoon; Park, Jung-Min; Kim, Un-ho; Kim, Kun-ho; et al, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, IEEE International Conference on Electrical Performance of Electronic Packaging Systems 2017, 2017-10-18 |
| Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects Choi, Sumin; Park, Junyong; Jung, Daniel H.; Kim, Joungho; Kim, Heegon; Kim, Kiyeong, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2139 - 2144, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Signal integrity analysis of vertical dual port coaxial connector for automotive system Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Hongseok; Kim, Jonghoon; Kim, Joungho; Park, Jung-Min; Kim, Ji-Min; et al, 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016, pp.165 - 167, Institute of Electrical and Electronics Engineers Inc., 2016-10 |
| Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11 |
| Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning Son, Kyungjune; Kim, Joungho; Kim, Keunwoo; Park, Gap Yeol; Lho, Daehwan; Park, Hyunwook; Sim, BooGyo; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 |
| Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08 |
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