Reduced Interface Diffusion of Cu Interconnects by Graphene-Based Capping Layer

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dc.contributor.author윤성준ko
dc.contributor.authorAlexander Yoonko
dc.contributor.author최성율ko
dc.contributor.author조병진ko
dc.date.accessioned2015-06-03T06:06:43Z-
dc.date.available2015-06-03T06:06:43Z-
dc.date.created2015-05-26-
dc.date.issued2015-03-26-
dc.identifier.citationThe 2nd Korean Graphene Symposium-
dc.identifier.urihttp://hdl.handle.net/10203/198673-
dc.languageEnglish-
dc.publisher한국그래핀연구회-
dc.titleReduced Interface Diffusion of Cu Interconnects by Graphene-Based Capping Layer-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 2nd Korean Graphene Symposium-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocation충남 부여 롯데 리조트-
dc.contributor.localauthor조병진-
dc.contributor.nonIdAuthor윤성준-
dc.contributor.nonIdAuthorAlexander Yoon-
dc.contributor.nonIdAuthor최성율-
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EE-Conference Papers(학술회의논문)
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