Influence of bacterial adhesion on copper extraction from printed circuit boards

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dc.contributor.authorSilva, Rene A.ko
dc.contributor.authorPark, Jeonghyunko
dc.contributor.authorLee, Eunseongko
dc.contributor.authorPark, Jaikooko
dc.contributor.authorChoi, Siyoungko
dc.contributor.authorKim, Hyunjungko
dc.date.accessioned2015-04-29T01:30:01Z-
dc.date.available2015-04-29T01:30:01Z-
dc.date.created2015-04-27-
dc.date.created2015-04-27-
dc.date.created2015-04-27-
dc.date.issued2015-03-
dc.identifier.citationSEPARATION AND PURIFICATION TECHNOLOGY, v.143, pp.169 - 176-
dc.identifier.issn1383-5866-
dc.identifier.urihttp://hdl.handle.net/10203/198323-
dc.description.abstractIn order to analyze the influence of the contact mechanism in the bioleaching process, bacterial attachment on the Printed Circuit Boards (PCB) surface was avoided using a partition system. The partition system was obtained with a semi-permeable membrane of 12-14 kDa MWCO. A PCB sample of 500-1000 mu m particle size was placed inside a partition system for 144 h to compare the copper (Cu) extraction rate by Acidithiobacillus ferrooxidans, with the Cu extraction of a system without partition. The results demonstrated that when the contact mechanism was avoided, there was a decrease of 25% in the Cu extraction. When the contact bioleaching was enabled, 1.46 g of Cu was extracted from the initial 1.61 g of Cu (similar to 91% extraction). When the partition system was used, only 1.10 g of Cu was extracted (similar to 68% extraction). Bacterial adhesion experiments proved that within the first hour of the experiment, 4.30 x 10(7) cells were attached per gram of PCB, supporting that bacterial adhesion was responsible for the higher Cu extraction rate. The results for bacterial adhesion tests were consistent with Derjaguin-Landau-Verwey-Overbeek theory.-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE BV-
dc.titleInfluence of bacterial adhesion on copper extraction from printed circuit boards-
dc.typeArticle-
dc.identifier.wosid000351966700021-
dc.identifier.scopusid2-s2.0-84922757421-
dc.type.rimsART-
dc.citation.volume143-
dc.citation.beginningpage169-
dc.citation.endingpage176-
dc.citation.publicationnameSEPARATION AND PURIFICATION TECHNOLOGY-
dc.identifier.doi10.1016/j.seppur.2015.01.038-
dc.contributor.localauthorChoi, Siyoung-
dc.contributor.nonIdAuthorSilva, Rene A.-
dc.contributor.nonIdAuthorPark, Jeonghyun-
dc.contributor.nonIdAuthorLee, Eunseong-
dc.contributor.nonIdAuthorPark, Jaikoo-
dc.contributor.nonIdAuthorKim, Hyunjung-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorPrinted circuit boards-
dc.subject.keywordAuthorBioleaching-
dc.subject.keywordAuthorCopper extraction-
dc.subject.keywordAuthorBacterial adhesion-
dc.subject.keywordPlusEXTRACELLULAR POLYMERIC SUBSTANCES-
dc.subject.keywordPlusMETAL SULFIDE OXIDATION-
dc.subject.keywordPlusZN-MN BATTERIES-
dc.subject.keywordPlusACIDITHIOBACILLUS-FERROOXIDANS-
dc.subject.keywordPlusTHIOBACILLUS-FERROOXIDANS-
dc.subject.keywordPlusACIDOPHILIC BACTERIA-
dc.subject.keywordPlusELECTRONIC SCRAP-
dc.subject.keywordPlusPOROUS-MEDIA-
dc.subject.keywordPlusSOLUTION CHEMISTRY-
dc.subject.keywordPlusMIXED CULTURE-
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