A study on the effects of nanofiber anisotropic conductive adhesive (Nanofiber ACA) properties on fine pitch interconnection stability of ACA flip-chip assemblies나노파이버 이방성 전도 접착제 특성이 미세피치 플립칩 어셈블리의 접속 안정성에 미치는 영향에 대한 연구

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dc.contributor.advisorPaik, Kyoung-Wook-
dc.contributor.advisor백경욱-
dc.contributor.authorSuk, Kyoung-Lim-
dc.contributor.author석경림-
dc.date.accessioned2015-04-23T07:10:30Z-
dc.date.available2015-04-23T07:10:30Z-
dc.date.issued2013-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=586390&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/197321-
dc.description학위논문(박사) - 한국과학기술원 : 신소재공학과, 2013.2, [ ix, 107 p. ]-
dc.description.abstractDisplay related electronics such as cellular phones, laptops, and televisions have become an indispensable part of our lives. In line with this, as people are demanding images with high quality, the number of electrical paths from a display driver chip to display panel are increasing, resulting in a reduction of the electrode pitch, which is the center-to-center distance between nearby electrodes. The most critical issue facing current display devices is interconnecting the fine pitch driver chip on the display panel using anisotropic conductive adhesives (ACAs) without an electrical short circuit phenomenon, since conductive particles in the adhesives can be agglomerated between fine pitch electrodes during the bonding process, thereby causing electrical noise in the X-Y directions. In this study, we suggest and investigate a new concept of nanofiber ACA that incorporates conductive particles into nanofiber to suppress conductive particle movement and to obtain stable three-dimensional electrical properties of fine pitch electronics. Chapter 2 describes the effects of nanofiber structures on the electrical properties of ACAs. Two types of nanofiber ACAs are suggested and are electrically characterized. One type has randomly distributed nanofibers in an anisotropic conductive adhesive (ACA) resin, and the other has randomly distributed nanofibers coupled with conductive particles (Cp/nanofiber) in a non-conductive film (NCF) resin. The PS nanofiber ACAs had stable contact resistances due to the PS melting effect during the bonding process. The PAN nanofiber ACAs, however, showed slightly higher contact resistances about 20~30%. This is attributed to the PAN’s thermal stability at the bonding temperature, which means that it was more difficult to squeeze out the thicker nanofibers from the bonding area. Nevertheless, the PAN/Cp nanofiber ACAs had stable contact resistances (4 mΩ), with values similar to those of the conventional ACA. The results of measurement ...eng
dc.languageeng-
dc.publisher한국과학기술원-
dc.subjectnanofiber-
dc.subject전도성 입자가 포함되어 있는 나노섬유-
dc.subject전기적 쇼트 회로-
dc.subject미세피치 전자기기-
dc.subject이방 전도성 접착제-
dc.subject나노섬유-
dc.subjectanisotropic conductive adhesive (ACA)-
dc.subjectfine pitch electronics-
dc.subjectelectrical short circuit-
dc.subjectconductive particle incorporated nanofiber (CPIN)-
dc.titleA study on the effects of nanofiber anisotropic conductive adhesive (Nanofiber ACA) properties on fine pitch interconnection stability of ACA flip-chip assemblies-
dc.title.alternative나노파이버 이방성 전도 접착제 특성이 미세피치 플립칩 어셈블리의 접속 안정성에 미치는 영향에 대한 연구-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN586390/325007 -
dc.description.department한국과학기술원 : 신소재공학과, -
dc.identifier.uid020095079-
dc.contributor.localauthorPaik, Kyoung-Wook-
dc.contributor.localauthor백경욱-
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