DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Sung-Hwan | ko |
dc.contributor.author | Yu, Jin | ko |
dc.date.accessioned | 2015-03-26T08:47:51Z | - |
dc.date.available | 2015-03-26T08:47:51Z | - |
dc.date.created | 2013-09-30 | - |
dc.date.created | 2013-09-30 | - |
dc.date.issued | 2013-09 | - |
dc.identifier.citation | MATERIALS LETTERS, v.106, pp.75 - 78 | - |
dc.identifier.issn | 0167-577X | - |
dc.identifier.uri | http://hdl.handle.net/10203/194201 | - |
dc.description.abstract | Sn-3.5Ag solder reacted with heat-treated Cu films, and the characteristics of Kirkendall void formation at the Cu3Sn/Cu interface were investigated. Heat-treatment for the suppression of Kirkendall void formation in Sn-3.5Ag/Cu solder joints was conducted at varying temperature (T=400, 500 and 600 degrees C). The results showed that S segregation on the void surfaces were effectively suppressed by heat-treatment, and Kirkendall voiding at the Cu3Sn/Cu interface decreased as the heat-treatment temperature was increased. According to the solid solubility limit of sulfur in Cu, S in Cu film was in solid solution at all heat-treatment temperatures, so the amount of sulfur segregation was reduced. (C) 2013 Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.subject | COPPER ELECTRODEPOSITION | - |
dc.subject | ELECTROPLATED COPPER | - |
dc.subject | ROOM-TEMPERATURE | - |
dc.subject | GLYCOL | - |
dc.subject | FILMS | - |
dc.subject | CU | - |
dc.title | Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints | - |
dc.type | Article | - |
dc.identifier.wosid | 000322682500021 | - |
dc.identifier.scopusid | 2-s2.0-84878343075 | - |
dc.type.rims | ART | - |
dc.citation.volume | 106 | - |
dc.citation.beginningpage | 75 | - |
dc.citation.endingpage | 78 | - |
dc.citation.publicationname | MATERIALS LETTERS | - |
dc.identifier.doi | 10.1016/j.matlet.2013.05.019 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Electrodeposition | - |
dc.subject.keywordAuthor | Metallurgy | - |
dc.subject.keywordAuthor | Microstructure | - |
dc.subject.keywordAuthor | Recrystallization | - |
dc.subject.keywordAuthor | Segregation | - |
dc.subject.keywordAuthor | Spectroscopy | - |
dc.subject.keywordPlus | COPPER ELECTRODEPOSITION | - |
dc.subject.keywordPlus | ELECTROPLATED COPPER | - |
dc.subject.keywordPlus | ROOM-TEMPERATURE | - |
dc.subject.keywordPlus | GLYCOL | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | CU | - |
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