Metal-containing thin film encapsulation with flexibility and high heat transfer

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dc.contributor.authorKwon, Jeong Hyunko
dc.contributor.authorKim, Eungtaekko
dc.contributor.authorPark, Sang-Hee Koko
dc.contributor.authorChoi, Kyung Cheolko
dc.date.accessioned2014-12-08T08:21:35Z-
dc.date.available2014-12-08T08:21:35Z-
dc.date.created2014-10-02-
dc.date.issued2014-08-27-
dc.identifier.citationThe 14th International Meeting on Information Display, IMID 2014-
dc.identifier.urihttp://hdl.handle.net/10203/191407-
dc.languageEnglish-
dc.publisherThe 14th International Meeting on Information Display, IMID 2014-
dc.titleMetal-containing thin film encapsulation with flexibility and high heat transfer-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 14th International Meeting on Information Display, IMID 2014-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationEXCO, Daegu-
dc.contributor.localauthorChoi, Kyung Cheol-
dc.contributor.nonIdAuthorKwon, Jeong Hyun-
dc.contributor.nonIdAuthorKim, Eungtaek-
dc.contributor.nonIdAuthorPark, Sang-Hee Ko-
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EE-Conference Papers(학술회의논문)
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