DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Hyeji | ko |
dc.contributor.author | Ahn, Changui | ko |
dc.contributor.author | Jo, Hyungyung | ko |
dc.contributor.author | Choi, Myounggeun | ko |
dc.contributor.author | Kim, Dong Seok | ko |
dc.contributor.author | Kim, Do Kyung | ko |
dc.contributor.author | Jeon, Seokwoo | ko |
dc.contributor.author | Choe, Heeman | ko |
dc.date.accessioned | 2014-09-02T02:31:57Z | - |
dc.date.available | 2014-09-02T02:31:57Z | - |
dc.date.created | 2014-08-12 | - |
dc.date.created | 2014-08-12 | - |
dc.date.issued | 2014-08 | - |
dc.identifier.citation | MATERIALS LETTERS, v.129, pp.174 - 177 | - |
dc.identifier.issn | 0167-577X | - |
dc.identifier.uri | http://hdl.handle.net/10203/189842 | - |
dc.description.abstract | Nanoporous metallic foams with an exceptionally high specific surface area can be a perfect solution for advanced energy applications. There have been an increasing number of recent efforts to achieve nanoporous metallic foams, but the latest research has paid much attention to the processing and characterization of noble nanoporous metallic foams (Pt and Au) through the conventional dealloying technique. This study proposes a new and innovative method of processing non-noble nanoporous (sub-micrometer-scale) metallic foams: a technique that combines the conventional electroless plating and three-dimensional proximity-field nanopatterning. Copper and nickel foams with sub-micrometer-scale pores are processed and characterized in this study. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.subject | ALLOYS | - |
dc.subject | COPPER | - |
dc.title | Large-area metal foams with highly ordered sub-micrometer-scale pores for potential applications in energy areas | - |
dc.type | Article | - |
dc.identifier.wosid | 000338818800048 | - |
dc.identifier.scopusid | 2-s2.0-84901443343 | - |
dc.type.rims | ART | - |
dc.citation.volume | 129 | - |
dc.citation.beginningpage | 174 | - |
dc.citation.endingpage | 177 | - |
dc.citation.publicationname | MATERIALS LETTERS | - |
dc.identifier.doi | 10.1016/j.matlet.2014.05.043 | - |
dc.contributor.localauthor | Kim, Do Kyung | - |
dc.contributor.localauthor | Jeon, Seokwoo | - |
dc.contributor.nonIdAuthor | Park, Hyeji | - |
dc.contributor.nonIdAuthor | Jo, Hyungyung | - |
dc.contributor.nonIdAuthor | Choi, Myounggeun | - |
dc.contributor.nonIdAuthor | Choe, Heeman | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Nanoporous | - |
dc.subject.keywordAuthor | Electroless plating | - |
dc.subject.keywordAuthor | Copper foam | - |
dc.subject.keywordAuthor | Nickel foam | - |
dc.subject.keywordAuthor | Metal foam | - |
dc.subject.keywordPlus | ALLOYS | - |
dc.subject.keywordPlus | COPPER | - |
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