DC Field | Value | Language |
---|---|---|
dc.contributor.author | Song, Yong-Ha | ko |
dc.contributor.author | Kim, Min-Wu | ko |
dc.contributor.author | Seo, Min-Ho | ko |
dc.contributor.author | Yoon, Jun-Bo | ko |
dc.date.accessioned | 2014-09-01T08:40:09Z | - |
dc.date.available | 2014-09-01T08:40:09Z | - |
dc.date.created | 2014-07-17 | - |
dc.date.created | 2014-07-17 | - |
dc.date.issued | 2014-06 | - |
dc.identifier.citation | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.23, no.3, pp.710 - 718 | - |
dc.identifier.issn | 1057-7157 | - |
dc.identifier.uri | http://hdl.handle.net/10203/189653 | - |
dc.description.abstract | This paper presents a microelectromechanical systems contact switch having both hard and soft contact materials in a single cantilever-type switching device. It operates with a zipping mechanism within which both contact materials (Pt-to-Pt and Au-to-Au) make individual contact sequentially and then detach in a reverse sequence to take advantage of both contact materials: low contact resistance and high reliability in a hot switching condition. In addition, an extended gate electrode and double T-shape cantilever beam structures effectively facilitate the sequential actuation. The fabricated switch successfully demonstrated a "dual-contact concept"-it made two sequential contacts at 31 (Pt-to-Pt) and 56 V (Au-to-Au) and it was then detached at 49 (Au-to-Au) and 23 V (Pt-to-Pt) in a single switching operation. Also, it achieved a low contact resistance of 0.3-0.5 Omega (including beam and some portion of the signal line resistances) at gate voltage from 60 to 70 V owing to the Au-to-Au contact in the device. Simultaneously, negligible contact resistance variation was observed during 2 x 10(6) cycles at a voltage/current level of 10 V/10 mA under hot switching and unpackaged environments, representing > 100-fold longer lifetime than that of a conventional Au-to-Au cantilever switch fabricated on the same wafer. [2013-0085] | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | LIFETIME | - |
dc.subject | MICRORELAYS | - |
dc.subject | RESISTANCE | - |
dc.subject | DEVICES | - |
dc.title | A Complementary Dual-Contact MEMS Switch Using a "Zipping" Technique | - |
dc.type | Article | - |
dc.identifier.wosid | 000337128200027 | - |
dc.identifier.scopusid | 2-s2.0-84901984715 | - |
dc.type.rims | ART | - |
dc.citation.volume | 23 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 710 | - |
dc.citation.endingpage | 718 | - |
dc.citation.publicationname | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | - |
dc.identifier.doi | 10.1109/JMEMS.2013.2281835 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Yoon, Jun-Bo | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Microelectromechanical systems (MEMS) switch | - |
dc.subject.keywordAuthor | MEMS relay | - |
dc.subject.keywordAuthor | reliability | - |
dc.subject.keywordAuthor | contact resistance | - |
dc.subject.keywordAuthor | microswitch | - |
dc.subject.keywordAuthor | contact material | - |
dc.subject.keywordAuthor | relay | - |
dc.subject.keywordAuthor | zipping | - |
dc.subject.keywordPlus | LIFETIME | - |
dc.subject.keywordPlus | MICRORELAYS | - |
dc.subject.keywordPlus | RESISTANCE | - |
dc.subject.keywordPlus | DEVICES | - |
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