Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, DM | ko |
| dc.contributor.author | Ryu, C | ko |
| dc.contributor.author | Lee, KY | ko |
| dc.contributor.author | Cho, BH | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Oh, TS | ko |
| dc.contributor.author | Lee, Won-Jong | ko |
| dc.contributor.author | Yu, Jin | ko |
| dc.date.accessioned | 2010-06-16T21:57:36Z | - |
| dc.date.available | 2010-06-16T21:57:36Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-05-29 | - |
| dc.identifier.citation | 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/18889 | - |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000247705500130 | - |
| dc.identifier.scopusid | 2-s2.0-35348919396 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 847 | - |
| dc.citation.endingpage | 852 | - |
| dc.citation.publicationname | 57th Electronic Components and Technology Conference 2007, ECTC '07 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Sparks, NV | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Jang, DM | - |
| dc.contributor.nonIdAuthor | Ryu, C | - |
| dc.contributor.nonIdAuthor | Lee, KY | - |
| dc.contributor.nonIdAuthor | Cho, BH | - |
| dc.contributor.nonIdAuthor | Oh, TS | - |
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