Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoo, Jeongsik | ko |
| dc.contributor.author | Park, Hyunjeong | ko |
| dc.contributor.author | Park, Jongbae | ko |
| dc.contributor.author | Kim, Junchul | ko |
| dc.contributor.author | Shim, Yujeong | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.date.accessioned | 2010-05-31T07:36:17Z | - |
| dc.date.available | 2010-05-31T07:36:17Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-01-27 | - |
| dc.identifier.citation | IEEE Electronics Packaging Technology Conference, EPTC, pp.1381 - 1386 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/18677 | - |
| dc.description.sponsorship | This work was supported by the IT R&D program of IC/IITA. [2007-S001-01, Development of High-Performance and Smallest SiP Technology]. | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000265818600221 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1381 | - |
| dc.citation.endingpage | 1386 | - |
| dc.citation.publicationname | IEEE Electronics Packaging Technology Conference, EPTC | - |
| dc.identifier.conferencecountry | SI | - |
| dc.identifier.conferencelocation | Singapore | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Yoo, Jeongsik | - |
| dc.contributor.nonIdAuthor | Park, Hyunjeong | - |
| dc.contributor.nonIdAuthor | Park, Jongbae | - |
| dc.contributor.nonIdAuthor | Kim, Junchul | - |
| dc.contributor.nonIdAuthor | Shim, Yujeong | - |
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