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College of Engineering(공과대학)Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)NE-Conference Papers(학술회의논문)

Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation

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dc.contributor.authorPak, Jiwoo-
dc.contributor.authorHa, Myunghyun-
dc.contributor.authorKim, Jaemin-
dc.contributor.authorKang, Donghee-
dc.contributor.authorChoi, Ho-
dc.contributor.authorKwon, Seyoung-
dc.contributor.authorLa, Keunsoo-
dc.date.accessioned2010-05-31T01:55:24Z-
dc.date.available2010-05-31T01:55:24Z-
dc.date.created2012-02-06-
dc.date.issued2009-01-27-
dc.identifier.citationIEEE Electronics Packaging Technology Conference, EPTC, v., no., pp.1387 - 1392-
dc.identifier.urihttp://hdl.handle.net/10203/18665-
dc.description.sponsorshipThis work was supported by the IT R&D program of MIC/IITA. [2007-S001-01, Development of High- Performance and Smallest SiP Technology].en
dc.languageENG-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleDesign of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage1387-
dc.citation.endingpage1392-
dc.citation.publicationnameIEEE Electronics Packaging Technology Conference, EPTC-
dc.identifier.conferencecountryUnited States-
dc.contributor.nonIdAuthorPak, Jiwoo-
dc.contributor.nonIdAuthorHa, Myunghyun-
dc.contributor.nonIdAuthorKim, Jaemin-
dc.contributor.nonIdAuthorKang, Donghee-
dc.contributor.nonIdAuthorChoi, Ho-
dc.contributor.nonIdAuthorKwon, Seyoung-
dc.contributor.nonIdAuthorLa, Keunsoo-
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