DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yang, Jun-Hyeok | ko |
dc.contributor.author | Park, Sang-Hui | ko |
dc.contributor.author | Choi, Jung-Min | ko |
dc.contributor.author | Kim, Hyun-Sik | ko |
dc.contributor.author | Park, Chang-Byung | ko |
dc.contributor.author | Ryu, Seung-Tak | ko |
dc.contributor.author | Cho, Gyu-Hyeong | ko |
dc.date.accessioned | 2013-12-06T01:12:30Z | - |
dc.date.available | 2013-12-06T01:12:30Z | - |
dc.date.created | 2013-10-04 | - |
dc.date.created | 2013-10-04 | - |
dc.date.issued | 2013-02-20 | - |
dc.identifier.citation | 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013, pp.390 - 391 | - |
dc.identifier.issn | 0193-6530 | - |
dc.identifier.uri | http://hdl.handle.net/10203/182765 | - |
dc.description.abstract | Capacitive touch-screen panels (TSPs) are widely used in recent high-end mobile products on the basis of their high quality of touch features, as well as superior visibility and durability [1-5]. Capacitive TSPs can be classified into self-capacitance [1,2] or mutual-capacitance [3-5] types, according to the sensing mechanism. Compared with the self-capacitance types, which offer low cost and high scan frequency from the simple line-sensing scheme, the mutual-capacitance types, which read out all sensor pixels, are presently widely preferred due to their multi-touch capabilities. However, the reduced sensing time for each sensor makes it difficult to achieve a high signal-to-noise ratio (SNR). Therefore, good noise performance in the analog front-end of the touch controller is essential for mutual-capacitance type TSPs. © 2013 IEEE. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | A highly noise-immune touch controller using Filtered-Delta-Integration and a charge-interpolation technique for 10.1-inch capacitive touch-screen panels | - |
dc.type | Conference | - |
dc.identifier.wosid | 000366612300165 | - |
dc.identifier.scopusid | 2-s2.0-84876527235 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 390 | - |
dc.citation.endingpage | 391 | - |
dc.citation.publicationname | 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Francisco, CA | - |
dc.identifier.doi | 10.1109/ISSCC.2013.6487783 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Hyun-Sik | - |
dc.contributor.localauthor | Ryu, Seung-Tak | - |
dc.contributor.localauthor | Cho, Gyu-Hyeong | - |
dc.contributor.nonIdAuthor | Yang, Jun-Hyeok | - |
dc.contributor.nonIdAuthor | Park, Sang-Hui | - |
dc.contributor.nonIdAuthor | Choi, Jung-Min | - |
dc.contributor.nonIdAuthor | Park, Chang-Byung | - |
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