(A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-On-Board assembly using anisotropic conductive films (ACFs)이방성 전도 필름을 이용한 고밀도 Flex-On-Board 실장용 상온 초음파 접합 방법에 대한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | Paik, Kyung-Wook | - |
| dc.contributor.advisor | 백경욱 | - |
| dc.contributor.author | Lee, Ki-Won | - |
| dc.contributor.author | 이기원 | - |
| dc.date.accessioned | 2013-09-12T04:42:26Z | - |
| dc.date.available | 2013-09-12T04:42:26Z | - |
| dc.date.issued | 2012 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487110&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/181950 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ iv, 86 p. ] | - |
| dc.language | eng | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | Adhesive | - |
| dc.subject | Solder | - |
| dc.subject | Ultrasonic | - |
| dc.subject | Flex-On-Board | - |
| dc.subject | 솔더 | - |
| dc.subject | 접착제 | - |
| dc.subject | 초음파 | - |
| dc.subject | 플렉스-온-보드 | - |
| dc.subject | 접속 | - |
| dc.subject | Interconnection | - |
| dc.title | (A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-On-Board assembly using anisotropic conductive films (ACFs) | - |
| dc.title.alternative | 이방성 전도 필름을 이용한 고밀도 Flex-On-Board 실장용 상온 초음파 접합 방법에 대한 연구 | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 487110/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020075120 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.localauthor | 백경욱 | - |
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