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(A) study on the bending properties of ultra-fine pitch chip-on-flex (COF) packages using anchoring polymer layer (APL) anisotropic conductive films (ACFs)link Yan, Pan; Paik, Kyoung-Wook; et al, 2021 |
ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics Yoon, Dal-Jin; Malik, Muhammad-Hassan; Yan, Pan; Paik, Kyung-Wook; Roshanghias, Ali, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292, 2021-01 |
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