Showing results 1 to 1 of 1
20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21 |
Discover