Showing results 1 to 7 of 7
A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure) Kim, HJ; Paik, Kyung-Wook; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01 |
Computer simulation of particle rearrangement in the presence of liquid Lee, SM; Chaix, JM; Martin, CL; Allibert, CH; Kang, Suk-Joong L, METALS AND MATERIALS-KOREA, v.5, no.2, pp.197 - 203, 1999-04 |
Formation of an alpha-SiAION layer on beta-SiAION and its effect on mechanical properties Jiang, X; Baek, YK; Lee, SM; Kang, Suk-Joong L, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.81, no.7, pp.1907 - 1912, 1998-07 |
Microstructure development during liquid-phase sintering Lee, SM; Lee, Sung-Min; Kang, Suk-Joong L; Kang, Suk-Joong L., ZEITSCHRIFT FUR METALLKUNDE, v.96, no.2, pp.141 - 147, 2005-02 |
Surface modification of SiAlON ceramics Lee, SM; Kim, HT; Baek, SS; Cho, SJ; Kang, Suk-Joong L, SIAIONS, v.237, pp.221 - 226, 2003 |
The effects of heat treatment condition and Si distribution on order-disorder transition in high Si steels Shin, JS; Lee, SM; Moon, BM; Lee, HyuckMo; Lee, Taek Dong; Lee, ZH, METALS AND MATERIALS INTERNATIONAL, v.10, no.6, pp.581 - 587, 2004-12 |
Theoretical analysis of liquid-phase sintering: Pore filling theory Lee, SM; Kang, Suk-Joong L, ACTA MATERIALIA, v.46, no.9, pp.3191 - 3202, 1998-05 |
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